Semiconductor package and method for fabricating a semiconductor package
US-10490470-B2 · Nov 26, 2019 · US
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Patent family 62201268
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 62201268 |
| Family type | — |
| Earliest priority | Dec 13, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10490470B2 — Semiconductor package and method for fabricating a semiconductor package |
Representative publication
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US10490470B2 — Semiconductor package and method for fabricating a semiconductor package (published Nov 26, 2019)
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