Aluminum compound, method of forming thin film by using the same, and method of fabricating integrated circuit device
US-10224200-B2 · Mar 5, 2019 · US
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Patent family 61560764
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 61560764 |
| Family type | — |
| Earliest priority | Sep 13, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10224200B2 — Aluminum compound, method of forming thin film by using the same, and method of fabricating integrated circuit device |
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US10224200B2 — Aluminum compound, method of forming thin film by using the same, and method of fabricating integrated circuit device (published Mar 5, 2019)
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