Wafer reinforcement to reduce wafer curvature
US-10304783-B2 · May 28, 2019 · US
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Patent family 58448015
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 58448015 |
| Family type | — |
| Earliest priority | Oct 2, 2015 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US10304783B2 — Wafer reinforcement to reduce wafer curvature |
Representative publication
Best representative member for this family based on priority and filing country.
US10304783B2 — Wafer reinforcement to reduce wafer curvature (published May 28, 2019)
Member publications
Related publications in this family.
Wafer reinforcement to reduce wafer curvature
US-2018005961-A1 · Jan 4, 2018 · US
Wafer reinforcement to reduce wafer curvature
US-9852999-B2 · Dec 26, 2017 · US
Wafer reinforcement to reduce wafer curvature
US-2017098616-A1 · Apr 6, 2017 · US