Embedding diamond and other ceramic media into metal substrates to form thermal interface materials
US-10074589-B2 · Sep 11, 2018 · US
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Patent family 58387750
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 58387750 |
| Family type | — |
| Earliest priority | Apr 14, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10074589B2 — Embedding diamond and other ceramic media into metal substrates to form thermal interface materials |
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US10074589B2 — Embedding diamond and other ceramic media into metal substrates to form thermal interface materials (published Sep 11, 2018)
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