Method for forming a semiconductor device and a semiconductor device
US-10020226-B2 · Jul 10, 2018 · US
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 57795377 |
| Family type | — |
| Earliest priority | Jul 31, 2015 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US10020226B2 — Method for forming a semiconductor device and a semiconductor device |
Best representative member for this family based on priority and filing country.
US10020226B2 — Method for forming a semiconductor device and a semiconductor device (published Jul 10, 2018)
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