Semiconductor device and wafer level package including such semiconductor device
US-10224287-B2 · Mar 5, 2019 · US
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 55272388 |
| Family type | — |
| Earliest priority | Mar 20, 2015 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US10224287B2 — Semiconductor device and wafer level package including such semiconductor device |
Best representative member for this family based on priority and filing country.
US10224287B2 — Semiconductor device and wafer level package including such semiconductor device (published Mar 5, 2019)
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