Semiconductor devices including an isolation layer on a fin and methods of forming semiconductor devices including an isolation layer on a fin
US-10128246-B2 · Nov 13, 2018 · US
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 55268024 |
| Family type | — |
| Earliest priority | Aug 11, 2014 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US10128246B2 — Semiconductor devices including an isolation layer on a fin and methods of forming semiconductor devices including an isolation layer on a fin |
Best representative member for this family based on priority and filing country.
US10128246B2 — Semiconductor devices including an isolation layer on a fin and methods of forming semiconductor devices including an isolation layer on a fin (published Nov 13, 2018)
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US-10128246-B2 · Nov 13, 2018 · US
US-2017271336-A1 · Sep 21, 2017 · US
US-9704864-B2 · Jul 11, 2017 · US