Molded composite enclosure for integrated circuit assembly
US-10056308-B2 · Aug 21, 2018 · US
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Patent family 54480363
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 54480363 |
| Family type | — |
| Earliest priority | May 15, 2014 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US10056308B2 — Molded composite enclosure for integrated circuit assembly |
Representative publication
Best representative member for this family based on priority and filing country.
US10056308B2 — Molded composite enclosure for integrated circuit assembly (published Aug 21, 2018)
Member publications
Related publications in this family.
Molded composite enclosure for integrated circuit assembly
US-2017170085-A1 · Jun 15, 2017 · US
Molded composite enclosure for integrated circuit assembly
US-9607914-B2 · Mar 28, 2017 · US