Molded composite enclosure for integrated circuit assembly

Patent metadata

Field	Value
Publication number	US-10056308-B2
Application number	US-201715431296-A
Country	US
Kind code	B2
Filing date	Feb 13, 2017
Priority date	May 15, 2014
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

Embodiments of the present disclosure are directed toward a molded composite enclosure for an integrated circuit (IC) assembly. In one embodiment, an enclosure for an integrated circuit (IC) assembly may include a molded lid structure having a body portion, and a side portion that extends from the body portion and forms a cavity configured to house the IC assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion such that the IC assembly can be thermally coupled with the contiguous exterior material through the opening. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. An enclosure for an integrated circuit (IC) assembly, the enclosure comprising:
a composite lid structure having
a body portion, and
a side portion that extends from the body portion and forms a cavity, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, and the contiguous interior material has an opening formed in the body portion; and

wherein the contiguous exterior material is thermally coupleable with the IC assembly placed within the cavity of the side portion by a thermal interface material through the opening of the contiguous interior material.

2. The enclosure of claim 1 , wherein the IC assembly includes heat-generating elements of a solid-state drive (SSD).

3. The enclosure of claim 1 , wherein the opening is one of multiple openings formed in the body portion such that the IC assembly can be thermally coupled with the contiguous exterior material through the multiple openings.

4. The enclosure of claim 1 , wherein the polymer includes at least one of ABS (Acrylonitrile Butadiene Styrene), ABS+PC (ABS+Polycarbonate), Acetal (PolyOxyMethylene, POM), Acrylic (Polymethyl Methacrylate, PMMA), LCP (Liquid Crystal Polymer), PA-Nylon 6(Polyamide), PA-Nylon 6/6 (Polyamide), PA-Nylon 11 (Polyamide), PBT (Polybutylene Terepthalate), PC (Polycarbonate), PEI (Polyetherimide), PE (Polyethylene), LDPE (Low Density Polyethylene), HDPE (High Density Polyethylene), PET (Polyethylene Terepthalate), PP (Polypropylene), PPA (Polyphthalamide), PPS (Polyphenylene Sulfide), PS (Polystyrene), HIPS (High Impact Polystyrene), PSU (Polysulfone), PU (Polyurethane), PVC (Polyvinylchloride), PVDF (Polyvinylidene Fluoride), SAN (Styrene Acrylonitrile), TPE (Thermoplastic Elastomer), or TPU (Thermoplastic Polyurethane).

5. The enclosure of claim 1 , wherein the metal includes aluminum (Al), iron (Fe), titanium (Ti), copper (Cu), nickel (Ni), magnesium (Mg), stainless steel, or Inconel.

6. The enclosure of claim 1 , further comprising:
a primer material disposed between the contiguous interior material and the contiguous exterior material to promote adhesion between the contiguous interior material and the contiguous exterior material.

7. The enclosure of claim 6 , wherein the primer material comprises a polymer or nano-structured metal oxide.

8. The enclosure of claim 1 , further comprising:
a base structure to couple with the composite lid structure such that the cavity is disposed between the base structure and the composite lid structure when the base structure is coupled with the composite lid structure.

9. The enclosure of claim 1 , wherein the composite lid structure has a rectangular profile.

10. The enclosure of claim 1 , wherein the thermal interface material includes a phase change material, thermal grease, a conductive thermoplastic or thermoset material, or an adhesive material.

11. The enclosure of claim 1 , wherein a wall of the enclosure includes an inset formed by a component of the IC assembly when the IC assembly is placed within the cavity of the side portion.

12. A solid-state drive (SSD) comprising:
a composite lid structure having:
a body portion, and
a side portion that extends from the body portion and forms a cavity, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, and the contiguous interior material has an opening formed in the body portion; and wherein the contiguous exterior material is thermally coupleable with an integrated circuit (IC) assembly placed within the cavity of the side portion by a thermal interface material through the opening of the contiguous interior material; and

a base structure coupled with the composite lid structure such that the cavity is disposed between the base structure and the composite lid structure.

13. The SSD of claim 12 , wherein:
the opening is one of multiple openings formed in the body portion; and
the IC assembly is thermally coupled with the contiguous exterior material through the multiple openings.

14. The SSD of claim 12 , wherein the polymer includes at least one of ABS (Acrylonitrile Butadiene Styrene), ABS+PC (ABS+Polycarbonate), Acetal (PolyOxyMethylene, POM), Acrylic (Polymethyl Methacrylate, PMMA), LCP (Liquid Crystal Polymer), PA-Nylon 6 (Polyamide), PA-Nylon 6/6 (Polyamide), PA-Nylon 11 (Polyamide), PBT (Polybutylene Terepthalate), PC (Polycarbonate), PEI (Polyetherimide), PE (Polyethylene), LDPE (Low Density Polyethylene), HDPE (High Density Polyethylene), PET (Polyethylene Terepthalate), PP (Polypropylene), PPA (Polyphthalamide), PPS (Polyphenylene Sulfide), PS (Polystyrene), HIPS (High Impact Polystyrene), PSU (Polysulfone), PU (Polyurethane), PVC (Polyvinylchloride), PVDF (Polyvinylidene Fluoride), SAN (Styrene Acrylonitrile), TPE (Thermoplastic Elastomer), or TPU (Thermoplastic Polyurethane).

15. The SSD of claim 12 , wherein the metal includes aluminum (Al), iron (Fe), titanium (Ti), copper (Cu), nickel (Ni), magnesium (Mg), stainless steel, or Inconel.

16. The SSD of claim 12 , further comprising:
a primer material disposed between the contiguous interior material and the contiguous exterior material to promote adhesion between the contiguous interior material and the contiguous exterior material.

17. The SSD of claim 12 , wherein the primer material comprises a polymer or nano-structured metal oxide.

18. The SSD of claim 12 , wherein the composite lid structure has a rectangular profile.

19. The SSD of claim 12 , wherein the thermal interface material includes a phase change material, thermal grease, a conductive thermoplastic or thermoset material, or an adhesive material.

20. The SSD of claim 12 , wherein a wall of the body portion includes an inset formed by a component of the IC assembly when the IC assembly is placed within the cavity of the side portion.

Assignees

• Intel Corp

Inventors

• Gwin Paul J

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07254

  changes in dispositions · CPC title

• H10W72/242

  relative to the surface, e.g. recessed, protruding · CPC title