Semiconductor package including stepwise stacked chips
US-10157883-B2 · Dec 18, 2018 · US
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Patent family 53521997
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 53521997 |
| Family type | — |
| Earliest priority | Jan 16, 2014 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US10157883B2 — Semiconductor package including stepwise stacked chips |
Representative publication
Best representative member for this family based on priority and filing country.
US10157883B2 — Semiconductor package including stepwise stacked chips (published Dec 18, 2018)
Member publications
Related publications in this family.
Semiconductor package including stepwise stacked chips
US-2017125378-A1 · May 4, 2017 · US
Semiconductor package including stepwise stacked chips
US-9589930-B2 · Mar 7, 2017 · US