Multiple bond via arrays of different wire heights on a same substrate
US-9728527-B2 · Aug 8, 2017 · US
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Patent family 53181971
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 53181971 |
| Family type | — |
| Earliest priority | Nov 22, 2013 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US9728527B2 — Multiple bond via arrays of different wire heights on a same substrate |
Representative publication
Best representative member for this family based on priority and filing country.
US9728527B2 — Multiple bond via arrays of different wire heights on a same substrate (published Aug 8, 2017)
Member publications
Related publications in this family.
Multiple bond via arrays of different wire heights on a same substrate
US-2016049390-A1 · Feb 18, 2016 · US
Multiple bond via arrays of different wire heights on a same substrate
US-9263394-B2 · Feb 16, 2016 · US
Multiple Bond Via Arrays of Different Wire Heights on a Same Substrate
US-2015145141-A1 · May 28, 2015 · US