Multiple bond via arrays of different wire heights on a same substrate

Patent metadata

Field	Value
Publication number	US-9263394-B2
Application number	US-201314087252-A
Country	US
Kind code	B2
Filing date	Nov 22, 2013
Priority date	Nov 22, 2013
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

An apparatus relating generally to a substrate is disclosed. In such an apparatus, a first bond via array has first wires extending from a surface of the substrate. A second bond via array has second wires extending from the surface of the substrate. The first bond via array is disposed at least partially within the second bond via array. The first wires of the first bond via array are of a first height. The second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.

First claim

What is claimed is:

1. An apparatus, comprising:
a substrate;
a first bond via array of first wire bond wires (“first wires”) extending from a surface of the substrate;
a second bond via array of second wire bond wires (“second wires”) extending from the surface of the substrate;
wherein the first bond via array and the second bond via array are external to the substrate;
wherein the first bond via array is disposed at least partially within the second bond via array;
wherein the first wires of the first bond via array are of a first height; and
wherein the second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.

2. The apparatus according to claim 1 , wherein the at least one die is a first die of a package-on-package configuration, wherein the package-on-package configuration comprises:
the first die coupled to first ends of the first wires;
a second die coupled to second ends of the second wires; and
wherein the second die is disposed over the first die.

3. The apparatus according to claim 2 , wherein the first die and the second die are coupled to one another.

4. The apparatus according to claim 3 , wherein the first die and the second die are coupled to one another by die-to-die interconnects.

5. The apparatus according to claim 3 , wherein the first die and the second die are coupled to one another by a spacer layer.

6. The apparatus according to claim 3 , wherein the first die and the second die are coupled to one another by a redistribution layer.

7. The apparatus according to claim 1 , wherein the at least one die is a first die of a package-on-package configuration, wherein the package-on-package configuration comprises:
the first die coupled to first ends of the first wires on a backside surface of the first die as a downward facing die; and
the second die coupled to second ends of the second wires on a backside surface of the second die as an upward facing die.

8. The apparatus according to claim 1 , wherein the at least one die is a first die of a package-on-package configuration, wherein the package-on-package configuration comprises:
the first die coupled to first ends of the first wires on a backside surface of the first die as a downward facing die; and
the second die coupled to second ends of the second wires on a backside surface of the second die as a downward facing die.

9. The apparatus according to claim 1 , wherein the at least one die is a first die of a package-on-package configuration, wherein the package-on-package configuration comprises:
the first die coupled to first ends of the first wires on a front side surface of the first die as an upward facing die; and
the second die coupled to second ends of the second wires on a backside surface of the second die as a downward facing die;
wherein a backside surface of the first die is coupled to the backside surface of the second die by die-to-die interconnects.

10. The apparatus according to claim 1 , wherein:
a first pitch of the first wires of the first bond via array is a first wire diameter of the first wires; and
a second pitch of the second wires of the second bond via array is a second wire diameter of the second wires.

11. The apparatus according to claim 10 , wherein the first wire diameter is smaller than the second wire diameter.

12. The apparatus according to claim 10 , wherein a portion of at least one of the first wires or the second wires includes angled wires thereof.

Assignees

• Invensas Corp

Inventors

• Uzoh Cyprian Emeka
• Katkar Rajesh

Classifications

• H10P50/283

  by chemical means · CPC title

• H10W90/794

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/792

  between multiple chips · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/752

  between stacked chips · CPC title