Method to pattern <10 micrometer conducting and passivating features on 3d substrates for implantable devices
US-2017348534-A1 · Dec 7, 2017 · US
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Patent family 52022896
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 52022896 |
| Family type | — |
| Earliest priority | Mar 15, 2013 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US2017348534A1 — Method to pattern <10 micrometer conducting and passivating features on 3d substrates for implantable devices |
Representative publication
Best representative member for this family based on priority and filing country.
US2017348534A1 — Method to pattern <10 micrometer conducting and passivating features on 3d substrates for implantable devices (published Dec 7, 2017)
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