Method to pattern <10 micrometer conducting and passivating features on 3d substrates for implantable devices

Patent metadata

Field	Value
Publication number	US-2017348534-A1
Application number	US-201715637995-A
Country	US
Kind code	A1
Filing date	Jun 29, 2017
Priority date	Mar 15, 2013
Publication date	Dec 7, 2017
Grant date	—

Abstract

An implantable device has a cylindrical base, at least one electrode on the cylindrical base, at least one electrically conducting lead on the cylindrical base connected to the electrode wherein the electrically conducting lead has a feature size of <10 micrometers. A protective coating on the cylindrical base covers the at least one electrically conducting lead.

First claim

1 . An implantable device, comprising:
a cylindrical base, at least one electrode on said cylindrical base, at least one electrically conducting lead on said cylindrical base connected to said electrode wherein said electrically conducting lead has a feature size of <10 micrometers, and a protective coating on said cylindrical base covering said at least one electrically conducting lead.

2 . The implantable device of claim 1 wherein said at least one electrode on said cylindrical base has a feature size of <10 micrometers.

3 . The implantable device of claim 1 wherein said at least one electrode on said cylindrical base is an electrically conducting metal electrode.

4 . The implantable device of claim 1 wherein said at least one electrode on said cylindrical base is an electrically conducting polymer electrode.

Assignees

• L Livermore Nat Security Llc

Inventors

• Tolosa Vanessa
• Pannu Satinderpall S
• Sheth Heeral
• Tooker Angela C
• Shah Kedar G
• Felix Sarah H

Classifications

• A61N1/05 Primary

  for implantation or insertion into the body, e.g. heart electrode (A61N1/06 takes precedence) · CPC title

• H05K3/02

  in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding · CPC title

• A61N1/3756 Primary

  Casings with electrodes thereon, e.g. leadless stimulators · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title