Method to pattern <10 micrometer conducting and passivating features on 3D substrates for implantable devices

Patent metadata

Field	Value
Publication number	US-9694190-B2
Application number	US-201414213733-A
Country	US
Kind code	B2
Filing date	Mar 14, 2014
Priority date	Mar 15, 2013
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

An implantable device has a cylindrical base, at least one electrode on the cylindrical base, at least one electrically conducting lead on the cylindrical base connected to the electrode wherein the electrically conducting lead has a feature size of <10 micrometers. A protective coating on the cylindrical base covers the at least one electrically conducting lead.

First claim

The invention claimed is:

1. A method of fabricating an implantable device, comprising the steps of:
providing a cylindrical base having an elongated cylindrical surface,
providing a rotation system for rotating said cylindrical base,
providing a deposition system for depositing material on said elongated cylindrical surface of said cylindrical base,
using said rotation system and said deposition system to deposit a first electrode, a second electrode, a third electrode, and a fourth electrode on said elongated cylindrical surface of said cylindrical base so that said first electrode, said second electrode, said a third electrode, and said fourth electrode are aligned on said elongated cylindrical surface of said cylindrical base,
using said rotation system and said deposition system
to deposit a first electrically conducting lead on said elongated cylindrical surface of said cylindrical base in a manner that allows said first electrically conducting lead to be curved and connected to said first electrode,
to deposit a second electrically conducting lead on said elongated cylindrical surface of said elongated cylindrical base in a manner that allows said second electrically conducting lead to be curved and connected to said second electrode,
to deposit a third electrically conducting lead on said elongated cylindrical surface of said cylindrical base in a manner that allows said third electrically conducting lead to be curved and connected to said third electrode,
to deposit a fourth electrically conducting lead on said elongated cylindrical surface of said cylindrical base in a manner that allows said second electrically conducting lead to be curved and connected to said fourth electrode, and
using said rotation system and said deposition system to deposit a protective coating on said elongated cylindrical surface of said cylindrical base covering said first electrically conducting lead, said second electrically conducting lead, said third electrically conducting lead, and said fourth electrically conducting lead.

2. The method of fabricating an implantable device of claim 1 wherein said step of using said rotation system and said deposition system to deposit a first electrode, a second electrode, a third electrode, and a fourth electrode on said elongated cylindrical surface of said cylindrical base so that said first electrode, said second electrode, said a third electrode, and said fourth electrode are aligned on said elongated cylindrical surface of said cylindrical base produces four in-line sensors with one side and with another side and wherein a first section of said elongated cylindrical surface of said cylindrical base is on said one side of said four in-line sensors and a second section of said elongated cylindrical surface of said cylindrical base is on said other side of said four in-line sensors, and
wherein said step of using said rotation system and said deposition system to deposit a first electrically conducting lead on said elongated cylindrical surface of said cylindrical base comprises using said rotation system and said deposition system to deposit a first electrically conducting lead on said first section of said elongated cylindrical surface of said cylindrical base, and
wherein said step of using said rotation system and said deposition system to deposit a second electrically conducting lead on said elongated cylindrical surface of said cylindrical base comprises using said rotation system and said deposition system to deposit a second electrically conducting lead on said first section of said elongated cylindrical surface of said cylindrical base,
wherein said step of using said rotation system and said deposition system to deposit a third electrically conducting lead on said elongated cylindrical surface of said cylindrical base comprises using said rotation system and said deposition system to deposit a third electrically conducting lead on said second section of said elongated cylindrical surface of said cylindrical base, and
wherein said step of using said rotation system and said deposition system to deposit a fourth electrically conducting lead on said elongated cylindrical surface of said cylindrical base comprises using said rotation system and said deposition system to deposit a fourth electrically conducting lead on said second section of said elongated cylindrical surface of said cylindrical base.

3. The method of fabricating an implantable device of claim 1 wherein said step of using said rotation system and said deposition system
to deposit a first electrically conducting lead on said elongated cylindrical surface of said cylindrical base in a manner that allows said first electrically conducting lead to be curved and connected to said first electrode,
to deposit a second electrically conducting lead on said elongated cylindrical surface of said cylindrical base in a manner that allows said second electrically conducting lead to be curved and connected to said second electrode,
to deposit a third electrically conducting lead on said elongated cylindrical surface of said cylindrical base in a manner that allows said third electrically conducting lead to be curved and connected to said third electrode,
to deposit a fourth electrically conducting lead on said elongated cylindrical surface of said cylindrical base in a manner that allows said second electrically conducting lead to be curved and connected to said fourth electrode
comprises using said rotation system and said deposition system
to deposit a first electrically conducting lead having a feature size of <10 micrometers,
to deposit a second electrically conducting lead having a feature size of <10 micrometers,
to deposit a third electrically conducting lead having a feature size of <10 micrometers, and
to deposit a fourth electrically conducting lead having a feature size of <10 micrometers.

4. The method of fabricating an implantable device of claim 1 wherein said step of using said rotation system and said deposition system to deposit a first electrode, a second electrode, a third electrode, and a fourth electrode on said base comprises using said rotation system and said deposition system to deposit a first electrode, a second electrode, a third electrode, and a fourth electrode each having a feature size of <10 micrometers.

5. The method of fabricating an implantable device of claim 1 wherein said step of using said rotation system and said deposition system
to deposit a first electrically conducting lead on said elongated cylindrical surface of said base in a manner that allows said first electrically conducting lead to be curved and connected to said first electrode,
to deposit a second electrically conducting lead on said elongated cylindrical surface of said cylindrical base in a manner that allows said second electrically conducting lead to be curved and connected to said second electrode,
to deposit a third electrically conducting lead on said elongated cylindrical surface of said cylindrical base in a manner that allows said third electrically conducting lead to be curved and connected to said third electrode,
to deposit a fourth electrically conducting lead on said elongated cylindrical surface of said cylindrical base in a manner that allows said second electrically conducting lead to be curved and connected to said fourth electrode
comprises using said rotation system and said deposition system
to deposit a first electrically conducting metal lead,
to deposit a second electrically conducting metal lead,
to deposit a third electrically conducting metal lead,
to deposit a fourth electrically conducting metal lead.

6. The method of fabricating an implantable device of claim 1 wherein said step of using said rotation system and said deposition system
to d

Assignees

• L Livermore Nat Security Llc

Inventors

• Tolosa Vanessa
• Pannu Satinderpall S
• Sheth Heeral
• Tooker Angela C
• Shah Kedar G
• Felix Sarah H

Classifications

• A61N1/05 Primary

  for implantation or insertion into the body, e.g. heart electrode (A61N1/06 takes precedence) · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• A61N1/3756 Primary

  Casings with electrodes thereon, e.g. leadless stimulators · CPC title

• H05K3/02

  in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding · CPC title