Wafer-to-wafer alignment method
US-10100858-B2 · Oct 16, 2018 · US
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Patent family 50773435
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 50773435 |
| Family type | — |
| Earliest priority | Apr 26, 2012 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US10100858B2 — Wafer-to-wafer alignment method |
Representative publication
Best representative member for this family based on priority and filing country.
US10100858B2 — Wafer-to-wafer alignment method (published Oct 16, 2018)
Member publications
Related publications in this family.
Wafer-to-wafer alignment method
US-2017045065-A1 · Feb 16, 2017 · US
Silicon alignment pins: an easy way to realize a wafer-to-wafer alignment
US-9512863-B2 · Dec 6, 2016 · US