Silicon alignment pins: an easy way to realize a wafer-to-wafer alignment

Patent metadata

Field	Value
Publication number	US-9512863-B2
Application number	US-201313871830-A
Country	US
Kind code	B2
Filing date	Apr 26, 2013
Priority date	Apr 26, 2012
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

A silicon alignment pin is used to align successive layers of components made in semiconductor chips and/or metallic components to make easier the assembly of devices having a layered structure. The pin is made as a compressible structure which can be squeezed to reduce its outer diameter, have one end fit into a corresponding alignment pocket or cavity defined in a layer of material to be assembled into a layered structure, and then allowed to expand to produce an interference fit with the cavity. The other end can then be inserted into a corresponding cavity defined in a surface of a second layer of material that mates with the first layer. The two layers are in registry when the pin is mated to both. Multiple layers can be assembled to create a multilayer structure. Examples of such devices are presented.

First claim

What is claimed is:

1. A system, comprising:
a first wafer comprising a first recess;
a second wafer comprising a second recess in a corresponding position to the first recess to allow alignment of the first and second wafers; and
an alignment pin configured to align the first and second wafers, the alignment pin having a first end and a second end, the alignment pin including
a compressible structure having a central axis, said compressible structure having an arcuate surface disposed about said central axis, said compressible structure having an aperture oriented along said central axis defined within said compressible structure, said compressible structure having two opposed projections each oriented in a direction perpendicular to said central axis and having a direction opposite to each other, said compressible structure configured to assume a relaxed configuration in which said two opposed projections are spaced apart when no mechanical force is applied to said two opposed projections and said compressible structure is configured to assume a compressed configuration upon the application of a mechanical force to said two opposed projections,
wherein the compressible structure has a gap in the arcuate surface where the two opposed projections are located, the gap being between 20 and 200 microns, and
wherein the compressible structure is configured to be inserted, in the compressed configuration, in part in the first recess and in part in the second recess, thereby aligning the first and second wafers.

2. The system of claim 1 , wherein said compressible structure is made of silicon.

3. The system of claim 1 , wherein said compressible structure has a length between 20 and 200 microns measured parallel to said central axis.

4. The system of claim 1 , wherein said two opposed projections are spaced apart by a distance measured in tens of microns when said mechanical force is not applied to said two opposed projections.

5. The system of claim 1 , wherein said first end and said second end each have a dimension d measured along a chord perpendicular to and intersecting said central axis, said chord having two ends, each of the two ends situated on said arcuate surface when said mechanical force is not applied to said two opposed projections and wherein said first end and said second end each have a dimension c smaller than said dimension d measured along a chord perpendicular to and intersecting said central axis, said chord having two ends, each of the two ends situated on said arcuate surface upon the application of mechanical force to said two opposed projections.

6. The system of claim 1 , wherein said compressible structure has a thickness between 40 and 100 microns.

7. The system of claim 1 , wherein said compressible structure has a thickness of 100 microns.

8. The system of claim 7 , wherein said compressible structure has a relaxed diameter of 1.025 mm.

9. The system of claim 1 , wherein the first recess and the second recess each comprise a first part configured to accept the arcuate surface of the compressible structure, and a second part configured to accept the two opposed projections of the compressible structure.

10. The system of claim 9 , wherein the first part is laterally narrower than the second part.

11. The system of claim 9 , wherein the first part has a circular cross-section and the second part has a rectangular cross-section, each of the first and second recesses having a cross-section formed by an intersection of the circular and rectangular cross-sections.

Assignees

• California Inst Of Techn

Inventors

• Jung-Kubiak Cecile
• Reck Theodore
• Thomas Bertrand
• Lin Robert H
• Peralta Alejandro
• Gill John J
• Lee Choonsup
• Siles Jose V
• Toda Risaku
• Chattopadhyay Goutam
• Cooper Ken B
• Mehdi Imran

Classifications

• Y10T29/49895

  Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"] · CPC title

• H05K13/0015

  Orientation; Alignment; Positioning · CPC title

• F16B19/004

  made in one piece (F16B21/084 takes precedence) · CPC title

• Y10T403/20

  with indicator or inspection means · CPC title

• Y10T29/49778

  with aligning, guiding, or instruction · CPC title