Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages
US-9620494-B2 · Apr 11, 2017 · US
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Patent family 46233302
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 46233302 |
| Family type | — |
| Earliest priority | Dec 15, 2010 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US9620494B2 — Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages |
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US9620494B2 — Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages (published Apr 11, 2017)
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