Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
US-10056165-B2 · Aug 21, 2018 · US
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Patent family 44914501
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 44914501 |
| Family type | — |
| Earliest priority | May 14, 2010 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10056165B2 — Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
Representative publication
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US10056165B2 — Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device (published Aug 21, 2018)
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