Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device

Patent metadata

Field	Value
Publication number	US-10032536-B2
Application number	US-201414291335-A
Country	US
Kind code	B2
Filing date	May 30, 2014
Priority date	May 14, 2010
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

One aspect of this copper alloy for an electronic device is composed of a binary alloy of Cu and Mg which includes Mg at a content of 3.3 to 6.9 atomic %, with a remainder being Cu and inevitable impurities, and a conductivity σ (% IACS) is within the following range when the content of Mg is given as A atomic %, σ≤{1.7241/(−0.0347×A 2 +0.6569×A+1.7)}×100. Another aspect of this copper alloy is composed of a ternary alloy of Cu, Mg, and Zn which includes Mg at a content of 3.3 to 6.9 atomic % and Zn at a content of 0.1 to 10 atomic %, with a remainder being Cu and inevitable impurities, and a conductivity σ (% IACS) is within the following range when the content of Mg is given as A atomic % and the content of Zn is given as B atomic %, σ≤{1.7241/(X+Y+1.7)}×100, X=−0.0347×A 2 +0.6569×A and Y=−0.0041×B 2 +0.2503×B.

First claim

The invention claimed is:

1. A copper alloy for an electronic device,
wherein the copper alloy is composed of a ternary alloy of Cu, Mg, and Zn,
the ternary alloy comprises Mg at a content in a range of 3.3 to 6.9 atomic % and Zn at a content in a range of 0.1 to 10 atomic %, with a remainder being Cu and inevitable impurities,
a conductivity σ (% IACS) satisfies the following relation when the content of Mg is given as A atomic % and the content of Zn is given as B atomic %,
σ≤{1.7241/( X′+Y′+ 1.7)}×100

X′=− 0.0292× A 2 +0.6797× A

Y′=− 0.0038× B 2 +0.2488× B , and

the copper alloy substantially consists of a Cu—Mg—Zn solid solution alloy supersaturated with Mg.

2. A rolled copper alloy for an electronic device, which is composed of the copper alloy for an electronic device according to claim 1 ,
wherein a Young's modulus E is in a range of 125 GPa or less, and a 0.2% proof stress σ 0.2 is in a range of 400 MPa or more.

3. The rolled copper alloy for an electronic device according to claim 2 ,
wherein the rolled copper alloy is used as a copper material that constitutes a terminal, a connector, or a relay.

Assignees

• Mitsubishi Materials Corp

Inventors

• Ito Yuki
• Maki Kazunari

Classifications

• C22C1/03

  using master alloys · CPC title

• C22C1/02

  by melting {(C22C1/1036 takes precedence)} · CPC title

• C22F1/08

  of copper or alloys based thereon · CPC title

• C22C9/04

  with zinc as the next major constituent · CPC title

• H01B1/026 Primary

  Alloys based on copper · CPC title