Semiconductor device
US-2025359283-A1 · Nov 20, 2025 · US
between a chip and a laterally-adjacent insulating package substrate, interposer or RDL
between a chip and a laterally-adjacent insulating package substrate, interposer or RDL · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W90/765 |
| Official title | {between a chip and a laterally-adjacent insulating package substrate, interposer or RDL} |
| Display label | between a chip and a laterally-adjacent insulating package substrate, interposer or RDL |
| Total patents | 61 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 4 |
| 2017 | 4 |
| 2018 | 4 |
| 2019 | 2 |
| 2020 | 4 |
| 2021 | 8 |
| 2022 | 4 |
| 2023 | 8 |
| 2024 | 12 |
| 2025 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device and electric power conversion unit
US-2025285932-A1 · Sep 11, 2025 · US
Semiconductor package including heat radiation structure, cooling system applying the semiconductor package, substrate including heat radiation structure and method of manufacturing the substrate
US-2025174521-A9 · May 29, 2025 · US
Semiconductor device
US-2025157892-A1 · May 15, 2025 · US
Fingerprint sensor package and smart card having the same
US-12294000-B2 · May 6, 2025 · US
Semiconductor device
US-2025079413-A1 · Mar 6, 2025 · US
Semiconductor device with a supporting member and bonded metal layers
US-12191223-B2 · Jan 7, 2025 · US
Power module with balanced current flow
US-2024379526-A1 · Nov 14, 2024 · US
Semiconductor device and method for manufacturing semiconductor device
US-2024355774-A1 · Oct 24, 2024 · US
Method of manufacturing semiconductor devices, corresponding ribbon, apparatus and device
US-2024250058-A1 · Jul 25, 2024 · US
Semiconductor device
US-12040301-B2 · Jul 16, 2024 · US
Semiconductor package and manufacturing method thereof
US-2024128218-A1 · Apr 18, 2024 · US
Power electronic device and method for fabricating the same
US-2024120309-A1 · Apr 11, 2024 · US
Power leadframe package with reduced solder voids
US-2024113064-A1 · Apr 4, 2024 · US
Fingerprint sensor package and smart card having the same
US-2024105703-A1 · Mar 28, 2024 · US
Semiconductor device
US-2024096764-A1 · Mar 21, 2024 · US
Semiconductor module, power converter, and power converter manufacturing method
US-2024071876-A1 · Feb 29, 2024 · US
Semiconductor apparatus
US-2024055355-A1 · Feb 15, 2024 · US
Direct substrate-side cooling in power device module
US-2024038632-A1 · Feb 1, 2024 · US
Power module and method for manufacturing same
US-2023369195-A1 · Nov 16, 2023 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W90/765?
- CPC H10W90/765 is the Cooperative Patent Classification code for “between a chip and a laterally-adjacent insulating package substrate, interposer or RDL.”
- How many patents are filed under CPC H10W90/765 (between a chip and a laterally-adjacent insulating package substrate, interposer or RDL)?
- Our database includes 61 publications tagged with this CPC code.
- Is patent activity under CPC H10W90/765 growing?
- Publication counts under this code: 12 in 2024 vs 8 in 2025 (latest complete years).