Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Cross-sectional shapes
Cross-sectional shapes · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W70/652 |
| Official title | Cross-sectional shapes |
| Display label | Cross-sectional shapes |
| Total patents | 3,223 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 108 |
| 2016 | 94 |
| 2017 | 125 |
| 2018 | 163 |
| 2019 | 241 |
| 2020 | 377 |
| 2021 | 416 |
| 2022 | 358 |
| 2023 | 338 |
| 2024 | 471 |
| 2025 | 442 |
| 2026 | 90 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor devices and methods of manufacturing
US-12166025-B2 · Dec 10, 2024 · US
Semiconductor package
US-2024355796-A1 · Oct 24, 2024 · US
Chip package unit with outer protective layer and method of manufactuirng the same
US-2024266239-A1 · Aug 8, 2024 · US
Semiconductor packages and methods for fabricating the same
US-2024203855-A1 · Jun 20, 2024 · US
Package structure and method of manufacturing the same
US-2024105664-A1 · Mar 28, 2024 · US
Semiconductor package
US-2024047418-A1 · Feb 8, 2024 · US
Semiconductor device having a through-substrate via
US-9224714-B2 · Dec 29, 2015 · US
TWO-SIDED-ACCESS EXTENDED WAFER-LEVEL BALL GRID ARRAY (eWLB) PACKAGE, ASSEMBLY AND METHOD
US-2015364453-A1 · Dec 17, 2015 · US
Electrical contact structure with a redistribution layer connected to a stud
US-9214579-B2 · Dec 15, 2015 · US
Chip package
US-9209124-B2 · Dec 8, 2015 · US
Process for Forming Package-on-Package Structures
US-2015348957-A1 · Dec 3, 2015 · US
Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch
US-9202713-B2 · Dec 1, 2015 · US
Electronic components assembly
US-9204530-B2 · Dec 1, 2015 · US
Semiconductor device
US-2015340331-A1 · Nov 26, 2015 · US
Method for generating die identification by measuring whether circuit is established in a package structure
US-9196549-B2 · Nov 24, 2015 · US
Semiconductor device and method of forming the same
US-9196505-B2 · Nov 24, 2015 · US
Method of forming post-passivation interconnect structure
US-2015325539-A1 · Nov 12, 2015 · US
Conductive connections, structures with such connections, and methods of manufacture
US-2015325543-A1 · Nov 12, 2015 · US
Semiconductor device
US-2015318265-A1 · Nov 5, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W70/652?
- CPC H10W70/652 is the Cooperative Patent Classification code for “Cross-sectional shapes.”
- How many patents are filed under CPC H10W70/652 (Cross-sectional shapes)?
- Our database includes 3,223 publications tagged with this CPC code.
- Is patent activity under CPC H10W70/652 growing?
- Publication counts under this code: 471 in 2024 vs 442 in 2025 (latest complete years).