Method of making metal substrates with structures formed therein
US-2024404922-A1 · Dec 5, 2024 · US
having an heterogeneous or anisotropic structure
having an heterogeneous or anisotropic structure · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W70/22 |
| Official title | {having an heterogeneous or anisotropic structure} |
| Display label | having an heterogeneous or anisotropic structure |
| Total patents | 114 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 5 |
| 2017 | 7 |
| 2018 | 14 |
| 2019 | 4 |
| 2020 | 17 |
| 2021 | 16 |
| 2022 | 15 |
| 2023 | 14 |
| 2024 | 10 |
| 2025 | 9 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device with a protruding base member
US-11201143-B2 · Dec 14, 2021 · US
Semiconductor devices and methods of manufacturing the same
US-11164808-B2 · Nov 2, 2021 · US
Microelectronic device including fiber-containing build-up layers
US-2021242132-A1 · Aug 5, 2021 · US
Method for producing a substrate plate, substrate plate, method for producing a semiconductor module and semiconductor module
US-2021210416-A1 · Jul 8, 2021 · US
Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component module
US-11037862-B2 · Jun 15, 2021 · US
Manufacturing a module with solder body having elevated edge
US-2021166952-A1 · Jun 3, 2021 · US
Semiconductor Device Comprising a Can Housing a Semiconductor Die which is Embedded by an Encapsulant
US-2021159204-A1 · May 27, 2021 · US
Microelectronic device including fiber-containing build-up layers
US-11004792-B2 · May 11, 2021 · US
Chip package and circuit board thereof
US-10993319-B1 · Apr 27, 2021 · US
Semiconductor device
US-10950526-B2 · Mar 16, 2021 · US
Semiconductor devices and methods of manufacturing the same
US-2021013120-A1 · Jan 14, 2021 · US
Semiconductor device
US-2020365498-A1 · Nov 19, 2020 · US
Semiconductor device
US-2020303360-A1 · Sep 24, 2020 · US
Power module
US-2020303273-A1 · Sep 24, 2020 · US
Package structure and communications device
US-2020294892-A1 · Sep 17, 2020 · US
Component structure, power module and power module assembly structure
US-2020294893-A1 · Sep 17, 2020 · US
Semiconductor device
US-2020286833-A1 · Sep 10, 2020 · US
Component structure, power module and power module assembly structure
US-10720378-B2 · Jul 21, 2020 · US
Method of manufacturing light emitting element mounting base member, method of manufacturing light emitting device using the light emitting element mounting base member, light emitting element mounting base member, and light emitting device using the light emitting element mounting base member
US-2020227607-A1 · Jul 16, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W70/22?
- CPC H10W70/22 is the Cooperative Patent Classification code for “having an heterogeneous or anisotropic structure.”
- How many patents are filed under CPC H10W70/22 (having an heterogeneous or anisotropic structure)?
- Our database includes 114 publications tagged with this CPC code.
- Is patent activity under CPC H10W70/22 growing?
- Publication counts under this code: 10 in 2024 vs 9 in 2025 (latest complete years).