Package architecture utilizing wafer to wafer bonding
US-2024379487-A1 · Nov 14, 2024 · US
Heat sink for cooling of power semiconductor modules
US9666504B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9666504-B2 |
| Application number | US-201214125255-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 2, 2012 |
| Priority date | Jun 30, 2011 |
| Publication date | May 30, 2017 |
| Grant date | May 30, 2017 |
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- Title
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- Abstract
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Abstract
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A heat sink for cooling at least one power semiconductor module, and that includes a basin for containing a cooling liquid. The basin has a contact rim for receiving the base plate and that includes a surface that is sloped inwards to the basin.
First claim
Opening claim text (preview).
The invention claimed is: 1. A heat sink for cooling at least one power semiconductor module mounted to a first surface of a base plate, wherein the base plate includes a second surface opposite the first surface, the heat sink comprising: a basin for containing a cooling liquid; and a contact rim arranged around the basin, wherein the contact rim has a flat surface that slopes inwards to the basin, and wherein the flat surface of the contact rim receives the second surface of the base plate, wherein the basin further comprises a recessed rim for receiving a gasket, wherein the recessed rim is arranged between the basin and the contact rim. 2. The heat sink of claim 1 , wherein the flat slope corresponds to a convex bending of the base plate of the at least one power semiconductor module. 3. The heat sink of claim 1 , wherein the angle of the flat slope is in the range of 0.1 degrees to 3 degrees. 4. The heat sink of claim 1 , wherein the angle of the flat slope is in the range of 0.5 degrees to 1.5 degrees. 5. The heat sink of claim 1 , wherein the basin has an inlet and an outlet for allowing circulation of the liquid coolant. 6. The heat sink of claim 1 , wherein the gasket is made with a double gasket containing an inner and an outer gasket. 7. The heat sink of claim 6 , wherein the gasket is made of EPDM rubber with a plastic carrier. 8. The heat sink of claim 1 , wherein the heat sink comprises at least two basins. 9. The heat sink of claim 1 , wherein the heat sink is made of a metal. 10. The heat sink of claim 1 , wherein the heat sink is made of molded plastic. 11. The heat sink of claim 10 , wherein the molded heat sink is made with a fibre reinforced plastic. 12. The heat sink of claim 1 , wherein the heat sink is made partly of plastic and partly of metal. 13. The heat sink of claim 1 , further comprising: a flow distributing element inserted in the basin.
Assignees
Inventors
Classifications
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
the connected ends being wedge-shaped · CPC title
Die-attach connectors and bond wires · CPC title
characterised by materials · CPC title
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Frequently asked questions
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- What does patent US9666504B2 cover?
- A heat sink for cooling at least one power semiconductor module, and that includes a basin for containing a cooling liquid. The basin has a contact rim for receiving the base plate and that includes a surface that is sloped inwards to the basin.
- Who is the assignee on this patent?
- Abeyasekera Tusitha, Anderson Thomas Lundgren, Møller Henrik B, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10W40/255. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 30 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).