Thermoplastic elastomer (tpe) adhesive carrier tape

Patent metadata

Field	Value
Publication number	US-2018166313-A1
Application number	US-201615376042-A
Country	US
Kind code	A1
Filing date	Dec 12, 2016
Priority date	Dec 12, 2016
Publication date	Jun 14, 2018
Grant date	—

Abstract

Embodiments relate to a carrier tape that includes a first layer of thermoplastic elastomer (TPE) adhesive tape. The carrier tape may further include a second layer of rigid polymer with a cavity. The rigid polymer may be coupled with a surface of the TPE adhesive tape such that the TPE adhesive tape is exposed by the cavity. A die may be coupled with the TPE adhesive tape within the cavity. Other embodiments may be described and/or claimed.

First claim

We claim:

1 . A carrier tape comprising:
a first layer of thermoplastic elastomer (TPE) adhesive tape; a second layer of rigid polymer that includes a cavity, the rigid polymer coupled with a surface of the TPE adhesive tape such that the TPE adhesive tape is exposed by the cavity; and a die coupled with the TPE adhesive tape within the cavity.

2 . The carrier tape of claim 1 , wherein the TPE tape includes styrene-ethylene-butadiene-styrene (SEBS).

3 . The carrier tape of claim 1 , wherein the rigid polymer includes polystyrene (PS) or polyethylene (PE).

4 . The carrier tape of claim 1 , wherein the TPE adhesive tape has a thickness measured in a direction perpendicular to the surface of less than approximately 100 micrometers (um).

5 . The carrier tape of claim 1 , wherein the second layer of rigid polymer includes a plurality of cavities, with a die coupled with the TPE adhesive tape in respective ones of the plurality of cavities.

6 . The carrier tape of claim 1 , wherein a lateral area of the cavity as measured in a direction parallel to the surface is greater than a lateral area of the die such that a portion of the TPE adhesive tape is exposed within the cavity when the die is within the cavity.

7 . The carrier tape of claim 1 , wherein the second layer of rigid polymer has a thickness measured in a direction perpendicular to the surface that is greater than a thickness of the die.

8 . A method comprising:
forming a first layer of thermoplastic elastomer (TPE) adhesive tape on a second layer of rigid polymer that includes a cavity, the rigid polymer coupled with a surface of the TPE adhesive tape such that the TPE adhesive tape is exposed by the cavity; and coupling a die with the TPE adhesive tape within the cavity.

9 . The method of claim 8 , wherein the TPE tape includes styrene-ethylene-butadiene-styrene (SEBS).

10 . The method of claim 8 , wherein the rigid polymer includes polystyrene (PS) or polyethylene (PE).

11 . The method of claim 8 , wherein the TPE adhesive tape has a thickness measured in a direction perpendicular to the surface of less than approximately 100 micrometers (um).

12 . The method of claim 8 , wherein the second layer of rigid polymer includes a plurality of cavities, with a die coupled with the TPE adhesive tape in respective ones of the plurality of cavities.

13 . The method of claim 8 , wherein a lateral area of the cavity as measured in a direction parallel to the surface is greater than a lateral area of the die such that a portion of the TPE adhesive tape is exposed within the cavity when the die is within the cavity.

14 . The method of claim 8 , wherein the second layer of rigid polymer has a thickness measured in a direction perpendicular to the surface that is greater than a thickness of the die.

15 . An apparatus comprising:
a first layer of thermoplastic elastomer (TPE) adhesive tape that includes a surface, wherein the TPE adhesive tape has a thickness measured in a direction perpendicular to the surface of approximately 100 micrometers (um); and a second layer of rigid polymer that includes a plurality of cavities, the rigid polymer coupled with the surface of the TPE adhesive tape such that the TPE adhesive tape is exposed by the plurality of cavities.

16 . The apparatus of claim 15 , wherein the TPE tape includes styrene-ethylene-butadiene-styrene (SEBS).

17 . The apparatus of claim 15 , wherein the rigid polymer includes polystyrene (PS) or polyethylene (PE).

18 . The apparatus of claim 15 , further comprising a plurality of dies, respective dies of the plurality of dies coupled with the TPE adhesive tape within respective cavities of the plurality of cavities.

19 . The apparatus of claim 18 , wherein a lateral area of a cavity of the plurality of cavities as measured in a direction parallel to the surface is greater than a lateral area of a die of the plurality of dies such that a portion of the TPE adhesive tape is exposed within the cavity when the die is within the cavity.

20 . The apparatus of claim 18 , wherein the second layer of rigid polymer has a thickness measured in a direction perpendicular to the surface that is greater than a thickness of a die of the plurality of dies.

Assignees

• Intel Corp

Inventors

• Dai Mingzhi
• Yin Wen
• Dunning Craig S
• Callan Robert D

Classifications

• H10P72/741

  the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10P72/7402 Primary

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title