Sealed substrate carriers and systems and methods for transporting substrates

Patent metadata

Field	Value
Publication number	US-9905447-B2
Application number	US-201414503859-A
Country	US
Kind code	B2
Filing date	Oct 1, 2014
Priority date	Oct 27, 2007
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects.

First claim

The invention claimed is:

1. A substrate carrier adapted to couple to a system component and carry one or more substrates, comprising:
a main body;
a carrier door coupled to the main body thereby forming an internal cavity adapted to receive the one or more substrates;
a resilient sealing member on at least one of the carrier door and main body forming a seal between the main body and the carrier door;
one or more ports coupled to the internal cavity adapted to evacuate the internal cavity and/or fill the internal cavity with an inert gas or a non-reactive gas;
a sealing surface provided on the main body and adapted to seal against a corresponding surface feature of the system component thereby forming a sealed environment between the carrier door and the system component; and
one or more environmental conditions in the sealed environment between the carrier door and the system component configured to be substantially equal to one or more environmental conditions within the internal cavity.

2. The substrate carrier of claim 1 wherein the main body comprises a flange extending outwardly from the main body, the flange having the sealing surface thereon.

3. The substrate carrier of claim 2 wherein the flange is set back rearwardly from the carrier door.

4. The substrate carrier of claim 2 wherein the flange and the carrier door are positioned at a front of the main body.

5. The substrate carrier of claim 2 wherein the flange is configured to couple to a load lock chamber of a processing tool or to a load port of a factory interface.

6. The substrate carrier of claim 1 wherein at least one of the one or more ports comprises a poppet valve, a gate valve, or a ball valve.

7. The substrate carrier of claim 1 , wherein the one or more environmental conditions includes a pressure of a gas.

8. The substrate carrier of claim 1 , wherein the one or more environmental conditions includes a temperature of a gas.

9. The substrate carrier of claim 1 , wherein the one or more environmental conditions includes gas content.

10. The substrate carrier of claim 1 , wherein the carrier door is adapted to be opened after the one or more environmental conditions within the sealed environment are substantially equal to the one or more environmental conditions within the internal cavity.

11. The substrate carrier of claim 1 , wherein the system component is factory interface.

Assignees

• Applied Materials Inc

Inventors

• Rice Michael Robert
• Hudgens Jeffrey C

Classifications

• H10P72/3408

  Docking arrangements · CPC title

• H10P72/1926

  characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier · CPC title

• H10P72/1922 Primary

  characterised by the construction of the closed carrier · CPC title

• H10P72/34 Primary

  the wafers being stored in a carrier, involving loading and unloading · CPC title

• Y10S414/137

  including means for charging or discharging wafer cassette · CPC title