Semiconductor Manufacturing Device to Securely Hold Reconstituted Panels for Transport and Manufacturing Processes

Patent metadata

Field	Value
Publication number	US-2022392795-A1
Application number	US-202117339210-A
Country	US
Kind code	A1
Filing date	Jun 4, 2021
Priority date	Jun 4, 2021
Publication date	Dec 8, 2022
Grant date	—

Abstract

A semiconductor manufacturing equipment has an outer case housing including a lower case extension to support a semiconductor panel. The lower case extension is fixed in position within the outer case housing. An inner case housing having an upper case extension is disposed within the outer case housing in proximity to the lower case extension. A mechanism draws the upper case extension toward the lower case extension and locks the semiconductor panel in place between the upper case extension and lower case extension. The mechanism has a cam assembly disposed above the inner case housing and operatable with a handle to rotate the cam assembly and apply pressure to the inner case housing and upper case extension to lock the semiconductor panel in place between the upper case extension and lower case extension. A spring or other elastic mechanism is disposed under the inner case housing to load the pressure.

First claim

1 . A method of making a semiconductor manufacturing equipment, comprising:
providing an outer case housing including a lower case extension adapted to support a semiconductor panel; providing an inner case housing including an upper case extension; disposing the inner case housing within the outer case housing so that the upper case extension is in proximity to the lower case extension; and providing a mechanism to assert pressure on the inner case housing and upper case extension to lock the semiconductor panel between the upper case extension and lower case extension.

2 . (canceled)

3 . The method of claim 1 , further including disposing a cam assembly above the inner case housing to apply pressure to the inner case housing and upper case extension to lock the semiconductor panel between the upper case extension and lower case extension.

4 . The method of claim 3 , further including providing a handle to rotate the cam assembly and apply pressure to the inner case housing and upper case extension to lock the semiconductor panel between the upper case extension and lower case extension.

5 . The method of claim 3 , further including providing an elastic mechanism under the inner case housing to load the pressure.

6 . The method of claim 5 , wherein the elastic mechanism includes a spring.

7 . A method of making a semiconductor manufacturing equipment, comprising:
providing an outer case housing including a lower case extension adapted to support a semiconductor panel; providing an inner case housing including an upper case extension; disposing the inner case housing within the outer case housing to have the upper case extension in proximity to the lower case extension; and providing a mechanism to move the upper case extension toward the lower case extension and lock the semiconductor panel in place between the upper case extension and lower case extension.

8 . (canceled)

9 . The method of claim 7 , further including disposing a cam assembly above the inner case housing to apply pressure to the inner case housing and upper case extension to move the upper case extension toward the lower case extension and lock the semiconductor panel in place between the upper case extension and lower case extension.

10 . The method of claim 9 , further including providing a handle to rotate the cam assembly and apply pressure to the inner case housing and upper case extension to move the upper case extension toward the lower case extension and lock the semiconductor panel in place between the upper case extension and lower case extension.

11 . The method of claim 9 , further including providing an elastic mechanism under the inner case housing to load the pressure.

12 . The method of claim 11 , wherein the elastic mechanism includes a spring.

13 . The method of claim 7 , wherein the lower case extension is fixed in position within the outer case housing.

14 . A semiconductor manufacturing equipment, comprising:
an outer case housing including a lower case extension adapted to support a semiconductor panel; an inner case housing including an upper case extension, wherein the inner case housing is disposed within the outer case housing with the upper case extension in proximity to the lower case extension; and a mechanism to assert pressure on the inner case housing and upper case extension to lock the semiconductor panel between the upper case extension and lower case extension.

15 . (canceled)

16 . The semiconductor manufacturing equipment of claim 14 , further including a cam assembly disposed above the inner case housing to apply pressure to the inner case housing and upper case extension to lock the semiconductor panel between the upper case extension and lower case extension.

17 . The semiconductor manufacturing equipment of claim 16 , further including a handle to rotate the cam assembly and apply pressure to the inner case housing and upper case extension to lock the semiconductor panel between the upper case extension and lower case extension.

18 . The semiconductor manufacturing equipment of claim 16 , further including an elastic mechanism disposed under the inner case housing to load the pressure.

19 . The semiconductor manufacturing equipment of claim 18 , wherein the elastic mechanism includes a spring.

20 . A semiconductor manufacturing equipment, comprising:
an outer case housing including a lower case extension adapted to support a semiconductor panel; an inner case housing including an upper case extension, wherein the inner case housing is disposed within the outer case housing to have the upper case extension in proximity to the lower case extension; and a mechanism to move the upper case extension toward the lower case extension and lock the semiconductor panel in place between the upper case extension and lower case extension.

21 . (canceled)

22 . The semiconductor manufacturing equipment of claim 20 , further including a cam assembly disposed above the inner case housing to apply pressure to the inner case housing and upper case extension to move the upper case extension toward the lower case extension and lock the semiconductor panel in place between the upper case extension and lower case extension.

23 . The semiconductor manufacturing equipment of claim 22 , further including a handle to rotate the cam assembly and apply pressure to the inner case housing and upper case extension to move the upper case extension toward the lower case extension and lock the semiconductor panel in place between the upper case extension and lower case extension.

24 . The semiconductor manufacturing equipment of claim 22 , further including an elastic mechanism disposed under the inner case housing to load the pressure.

25 . The semiconductor manufacturing equipment of claim 24 , wherein the elastic mechanism includes a spring.

Assignees

• Stats Chippac Pte Ltd

Inventors

• Lee Hyeonchul
• Park Kyounghee
• Kim Kyunghwan

Classifications

• H10P72/1918

  characterised by coupling elements, kinematic members, handles or elements to be externally gripped · CPC title

• H10P72/1912

  characterised by shock absorbing elements, e.g. retainers or cushions · CPC title

• H10P72/1908

  specially adapted for containing substrates other than wafers · CPC title

• H10P72/1914 Primary

  characterised by locking systems · CPC title

• H10P72/14 Primary

  Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls · CPC title