Processing method of device wafer

Patent metadata

Field	Value
Publication number	US-11646229-B2
Application number	US-202117172316-A
Country	US
Kind code	B2
Filing date	Feb 10, 2021
Priority date	Feb 21, 2020
Publication date	May 9, 2023
Grant date	May 9, 2023

Abstract

A processing method of a device wafer includes a mask coating step of coating a front surface of the device wafer with a water-soluble resin, a mask forming step of applying a laser beam along each division line, forming a groove, and removing a protective mask and a functional layer to expose a substrate, a plasma etching step of forming a division groove that divides the substrate along the groove by supplying a gas in a plasma condition, an expanding step of expanding a protective tape in a plane direction to expand a width of the division groove, an adhesive film dividing step of applying a laser beam along the division groove to divide the adhesive film that has been exposed due to the formation of the division groove, and a cleaning step of cleaning and removing the water-soluble resin.

First claim

What is claimed is:

1. A processing method of a device wafer which has a functional layer layered on a front surface of a substrate, the functional layer having a plurality of devices and a plurality of division lines formed therein, the plurality of division lines demarcating the plurality of devices and crossing each other, the processing method comprising:
a mask coating step of coating, after a state in which an adhesive film for die-bonding attached to a back surface of the device wafer is attached to a front surface of a protective tape mounted to an annular frame is prepared, a front surface of the device wafer with a water-soluble resin as a protective mask;
a mask forming step of, after the mask coating step is carried out, applying a laser beam to the front surface of the device wafer, forming a groove along each of the division lines by ablation processing, and removing the protective mask and the functional layer to expose the substrate;
a plasma etching step of, after the mask forming step is carried out, supplying a gas in a plasma condition to the front surface of the device wafer to form a division groove that divides the substrate along the groove;
an expanding step of, after the plasma etching step is carried out, expanding the protective tape in a plane direction to expand a width of the division groove, thereby forming an expanded division groove;
an adhesive film dividing step of, after the expanding step is carried out, applying a laser beam to the adhesive film that has been exposed due to the formation of the expanded division groove, and dividing the adhesive film along the expanded division groove by ablation processing; and
a cleaning step of, after the adhesive film dividing step is carried out, cleaning and removing the water-soluble resin.

2. The processing method of a device wafer according to claim 1 , further comprising:
an additional coating step of applying the water-soluble resin to the device wafer that has the division groove formed therein, after the plasma etching step is carried out and before the adhesive film dividing step is carried out.

3. The processing method of a device wafer according to claim 1 , further comprising:
a contracting step, after the expanding step, of contracting the protective tape in the opposite plane direction as the expanding step while still maintaining the expanded division groove, wherein a heating unit heats a portion of the protective tape between an inner edge of the annular frame and an outer edge of the adhesive film during the contracting step.

4. The processing method of a device wafer according to claim 1 , wherein, during the expanding step, a holding surface of a holding table applies a uniform external force in a radial direction to the protective tape.

5. The processing method of a device wafer according to claim 1 , wherein, during the expanding step, a plurality of roller members press against the protective tape.

Assignees

• Disco Corp

Inventors

• Suzuki Minoru

Classifications

• H10P72/742

  involving stretching of the auxiliary support post dicing · CPC title

• H10P72/7402 Primary

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P70/40

  Cleaning for reclaiming · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H10P34/42

  with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) · CPC title