Dynamic precursor dosing for atomic layer deposition
US-2017362705-A9 · Dec 21, 2017 · US
characterised by the type of materials
characterised by the type of materials · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P14/66 |
| Official title | {characterised by the type of materials} |
| Display label | characterised by the type of materials |
| Total patents | 246 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 13 |
| 2016 | 26 |
| 2017 | 35 |
| 2018 | 38 |
| 2019 | 40 |
| 2020 | 25 |
| 2021 | 22 |
| 2022 | 16 |
| 2023 | 7 |
| 2024 | 11 |
| 2025 | 11 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Sintered body and electrostatic chuck
US-2017358476-A1 · Dec 14, 2017 · US
Organic thin film transistor and method of manufacturing the same
US-2017331060-A1 · Nov 16, 2017 · US
Deposited material and method of formation
US-9818885-B2 · Nov 14, 2017 · US
Selective deposition using hydrophobic precursors
US-2017323776-A1 · Nov 9, 2017 · US
Semiconductor device and its manufacturing method
US-2017317221-A1 · Nov 2, 2017 · US
Method for structuring a substrate
US-9768023-B1 · Sep 19, 2017 · US
Method for semiconductor device fabrication with improved source drain epitaxy
US-9748389-B1 · Aug 29, 2017 · US
Methods of forming a low-k dielectric layer and methods of fabricating a semiconductor device using the same
US-2017207083-A1 · Jul 20, 2017 · US
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
US-9691606-B2 · Jun 27, 2017 · US
Method of manufacturing substrate for organic electronic device
US-9691995-B2 · Jun 27, 2017 · US
Methods of forming dielectric layers and methods of manufacturing semiconductor devices using the same
US-9685498-B2 · Jun 20, 2017 · US
Method for structuring a substrate
US-2017154767-A1 · Jun 1, 2017 · US
Low vapor pressure aerosol-assisted cvd
US-2017137937-A1 · May 18, 2017 · US
NbMC LAYERS
US-2017117141-A1 · Apr 27, 2017 · US
Processing of thin film organic ferroelectric materials using pulsed electromagnetic radiation
US-2017114241-A1 · Apr 27, 2017 · US
Deposited Material and Method of Formation
US-2017103884-A1 · Apr 13, 2017 · US
Dynamic precursor dosing for atomic layer deposition
US-2017096735-A1 · Apr 6, 2017 · US
Method for a non-aqueous electroless polyol deposition of metal or metal alloy in features of a substrate
US-2017073815-A1 · Mar 16, 2017 · US
Methods of forming highly p-type doped germanium tin films and structures and devices including the films
US-2017047446-A1 · Feb 16, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P14/66?
- CPC H10P14/66 is the Cooperative Patent Classification code for “characterised by the type of materials.”
- How many patents are filed under CPC H10P14/66 (characterised by the type of materials)?
- Our database includes 246 publications tagged with this CPC code.
- Is patent activity under CPC H10P14/66 growing?
- Publication counts under this code: 11 in 2024 vs 11 in 2025 (latest complete years).