Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias
US-10483248-B2 · Nov 19, 2019 · US
Shaping or machining of piezoelectric or electrostrictive bodies
Shaping or machining of piezoelectric or electrostrictive bodies · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10N30/08 |
| Official title | Shaping or machining of piezoelectric or electrostrictive bodies |
| Display label | Shaping or machining of piezoelectric or electrostrictive bodies |
| Total patents | 151 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 16 |
| 2016 | 18 |
| 2017 | 15 |
| 2018 | 9 |
| 2019 | 14 |
| 2020 | 15 |
| 2021 | 14 |
| 2022 | 13 |
| 2023 | 16 |
| 2024 | 12 |
| 2025 | 8 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for manufacturing ultrasound transducers
US-10347818-B2 · Jul 9, 2019 · US
Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias
US-2018277527-A1 · Sep 27, 2018 · US
Metallic glass meshes, actuators, sensors, and methods for constructing the same
US-10056541-B2 · Aug 21, 2018 · US
Electro-Holographic Light Field Generators and Displays
US-2018217414-A1 · Aug 2, 2018 · US
SAW Modulators and Light Steering Methods
US-2018217473-A1 · Aug 2, 2018 · US
Methods of manufacturing high frequency piezocomposite ultrasound transducers
US-9997696-B2 · Jun 12, 2018 · US
Piezoelectric device
US-2018114893-A1 · Apr 26, 2018 · US
Ultrasonic device, method for manufacturing the same, electronic device and ultrasonic imaging device
US-2018047891-A1 · Feb 15, 2018 · US
Inkjet head
US-9868281-B2 · Jan 16, 2018 · US
Method for producing piezoelectric multi-layered components
US-2018006209-A1 · Jan 4, 2018 · US
Ultrasonic device, method for manufacturing the same, electronic device and ultrasonic imaging device
US-9818929-B2 · Nov 14, 2017 · US
Piezoelectric device
US-2017317265-A1 · Nov 2, 2017 · US
Method for manufacturing a piezoelectric device
US-2017309808-A1 · Oct 26, 2017 · US
Collective process for ultrasound transducers
US-2017288638-A1 · Oct 5, 2017 · US
Electrostrictive element manufacturing method
US-9773969-B2 · Sep 26, 2017 · US
Stretch frame for stretching process
US-9761790-B2 · Sep 12, 2017 · US
Flexible pmut array
US-2017252777-A1 · Sep 7, 2017 · US
Inkjet head
US-2017232738-A1 · Aug 17, 2017 · US
Apodization of Piezo-Composite Acoustic Elements
US-2017167253-A1 · Jun 15, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10N30/08?
- CPC H10N30/08 is the Cooperative Patent Classification code for “Shaping or machining of piezoelectric or electrostrictive bodies.”
- How many patents are filed under CPC H10N30/08 (Shaping or machining of piezoelectric or electrostrictive bodies)?
- Our database includes 151 publications tagged with this CPC code.
- Is patent activity under CPC H10N30/08 growing?
- Publication counts under this code: 12 in 2024 vs 8 in 2025 (latest complete years).