Chip transfer method and electronic device
US-12512360-B2 · Dec 30, 2025 · US
using pick-and-place processes
using pick-and-place processes · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10H29/02 |
| Official title | using pick-and-place processes |
| Display label | using pick-and-place processes |
| Total patents | 120 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2018 | 1 |
| 2019 | 4 |
| 2020 | 5 |
| 2021 | 5 |
| 2022 | 7 |
| 2023 | 11 |
| 2024 | 15 |
| 2025 | 48 |
| 2026 | 24 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Display device, method of manufacturing display device, and electronic device comprising display device
US-2025374734-A1 · Dec 4, 2025 · US
Semiconductor device and method for forming the same
US-2025366280-A1 · Nov 27, 2025 · US
Method for display manufacturing using groups of micro-LEDs and micro-LED arrays
US-12451475-B2 · Oct 21, 2025 · US
Circuit board having multiple solder resists and displaying apparatus having the same
US-12419149-B2 · Sep 16, 2025 · US
Semiconductor device arrangement and method of manufacturing the same
US-2025248190-A1 · Jul 31, 2025 · US
Light-emitting element array substrate and method for manufacturing light-emitting element array substrate
US-2025239477-A1 · Jul 24, 2025 · US
Method and apparatus for fabricating display device
US-2025221125-A1 · Jul 3, 2025 · US
Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component
US-12342467-B2 · Jun 24, 2025 · US
Display device and method for fabricating the same
US-2025143027-A1 · May 1, 2025 · US
Method of manufacturing semiconductor composite device
US-2025096217-A1 · Mar 20, 2025 · US
Method for manufacturing electronic device
US-2025015058-A1 · Jan 9, 2025 · US
Electronic device and manufacturing method thereof
US-12183721-B2 · Dec 31, 2024 · US
Transfer substrate and transfer method using the same
US-2024429209-A1 · Dec 26, 2024 · US
Method for repairing display module
US-2024421279-A1 · Dec 19, 2024 · US
Receptor substrate, method for manufacturing receptor substrate, transfer method, method for manufacturing led panel, and stamper
US-2024404865-A1 · Dec 5, 2024 · US
Displaying apparatus having light emitting device, method of manufacturing the same and method of transferring light emitting device
US-12136611-B2 · Nov 5, 2024 · US
Unit pixel having light emitting device and displaying apparatus
US-12113151-B2 · Oct 8, 2024 · US
LED chip transfer method and display panel
US-12113053-B2 · Oct 8, 2024 · US
Selective photo-induced transfer of good micro leds
US-2024290647-A1 · Aug 29, 2024 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10H29/02?
- CPC H10H29/02 is the Cooperative Patent Classification code for “using pick-and-place processes.”
- How many patents are filed under CPC H10H29/02 (using pick-and-place processes)?
- Our database includes 120 publications tagged with this CPC code.
- Is patent activity under CPC H10H29/02 growing?
- Publication counts under this code: 15 in 2024 vs 48 in 2025 (latest complete years).