Laminate, bonding method, and intermediate product for circuit board

Patent metadata

Field	Value
Publication number	US-12336117-B2
Application number	US-202017786173-A
Country	US
Kind code	B2
Filing date	Dec 17, 2020
Priority date	Dec 17, 2019
Publication date	Jun 17, 2025
Grant date	Jun 17, 2025

Abstract

A laminate includes: a base material; a circuit; an insulating layer provided between the base material and the circuit, the insulating layer including a thermally conductive filler; and an adhesive configured to bond at least the base material and the insulating layer. The base material and the insulating layer are bonded by the adhesive in part and in contact with each other in other parts. A plurality of spaces are formed in the insulating layer, and the adhesive fills at least a portion of the plurality of spaces.

First claim

The invention claimed is:

1. A laminate comprising:
a base material;
a circuit;
an insulating layer provided between the base material and the circuit, the insulating layer including a thermally conductive filler; and
an adhesive configured to bond at least the base material and the insulating layer, wherein
the base material and the insulating layer are bonded by the adhesive in part and in contact with each other in other parts,
the insulating layer includes a plurality of spaces formed therein, and
the adhesive fills at least a portion of the plurality of spaces.

2. The laminate according to claim 1 , wherein
the adhesive is configured to bond the circuit and the insulating layer, and
the circuit and the insulating layer are bonded by the adhesive in part and in contact with each other in other parts.

3. The laminate according to claim 2 , wherein the insulating layer includes 60% to 85% of the filler by volume.

4. A laminate comprising:
a base material;
a circuit;
an insulating layer provided between the base material and the circuit, the insulating layer including an insulating filler; and
an adhesive configured to bond at least the circuit and the insulating layer, wherein
the circuit and the insulating layer are bonded by the adhesive in part and in contact with each other in other parts,
the insulating layer includes a plurality of spaces formed therein, and
the adhesive fills at least a portion of the plurality of spaces that lead to a surface on a side of the circuit.

5. The laminate according to claim 1 , wherein the insulating layer includes 60% to 85% of the filler by volume.

6. The laminate according to claim 4 , wherein the insulating layer includes 60% to 85% of the filler by volume.

7. A bonding method for a laminate including: a base material; a circuit; an insulating layer provided between the base material and the circuit, the insulating layer including an insulating filler; and an adhesive configured to bond at least the base material and the insulating layer, the bonding method comprising:
permeating liquid adhesive into at least a portion of spaces formed in the insulating layer by applying the liquid adhesive to a bonding surface of the insulating layer to which the base material is bonded; and
stacking the bonding surface of the insulating layer and a bonding surface of the base material, and curing the liquid adhesive by pressurizing at a high temperature.

8. An intermediate product for a circuit board, comprising:
an insulating layer; and
an adhesive, wherein
the insulating layer includes a plurality of spaces formed therein,
the adhesive fills at least a portion of the plurality of spaces, and
a part of a surface of the insulating layer where the plurality of spaces are not formed is exposed.

Assignees

• Nhk Spring Co Ltd

Inventors

• Kawakami Takeshi

Classifications

• H05K2201/0263

  Details about a collection of particles · CPC title

• H05K2201/0209

  Inorganic, non-metallic particles · CPC title

• H05K1/056

  the metal substrate being covered by an organic insulating layer · CPC title

• H05K1/0373 Primary

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• H05K3/0061

  onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20) · CPC title