Protection tape for printed circuit board and display device including the same

Patent metadata

Field	Value
Publication number	US-11034128-B2
Application number	US-202016887310-A
Country	US
Kind code	B2
Filing date	May 29, 2020
Priority date	Apr 19, 2016
Publication date	Jun 15, 2021
Grant date	Jun 15, 2021

Abstract

A protection tape for a printed circuit board (PCB) includes an insulating base plate, a conductive layer over the insulating base plate, and an adhesive layer over the conductive layer, the adhesive layer including a main part having a first thickness and a subsidiary part having a second thickness less than the first thickness, the main part corresponding to at least a center portion of the insulating base plate and the subsidiary part being arranged at an outside of the main part.

First claim

What is claimed is:

1. A protection tape for a printed circuit board (PCB), the protection tape comprising:
an insulating base plate;
a conductive layer over the insulating base plate; and
an adhesive layer over the conductive layer, the adhesive layer including a main part having a first thickness and a subsidiary part having a second thickness less than the first thickness, the main part corresponding to at least a center portion of the insulating base plate and the subsidiary part being arranged at an outside of the main part, wherein:
the subsidiary part includes a first subsidiary part positioned at one side of the main part and a second subsidiary part positioned at another side of the main part, the first subsidiary part and the second subsidiary part being spaced apart from the main part,
and wherein:
the main part includes a groove in an upper surface of the main part, the groove extending in a direction between the second subsidiary part and the first subsidiary part, or
the main part includes an opening in the upper surface of the main part, the opening extending in the direction between the second subsidiary part and the first subsidiary part in an upper surface of the main part.

2. The protection tape for a PCB as claimed in claim 1 , wherein the subsidiary part is positioned outside the main part and surrounds the main part.

3. The protection tape for a PCB as claimed in claim 1 , wherein the first subsidiary part and the second subsidiary part of the adhesive layer are located adjacent to opposite ends of the main part of the adhesive layer.

4. The protection tape for a PCB as claimed in claim 1 , wherein the groove or opening extends from an end of the main part next to the first subsidiary part to an end of the main part next to the second subsidiary part.

5. A protection tape for a printed circuit board (PCB), the protection tape comprising:
an insulating base plate;
a conductive layer over the insulating base plate; and
an adhesive layer over the conductive layer, the adhesive layer including a main part having a first thickness and a subsidiary part having a second thickness less than the first thickness, the main part corresponding to at least a center portion of the insulating base plate and the subsidiary part being arranged at an outside of the main part, wherein:
the subsidiary part includes a first subsidiary part positioned at one side of the main part and a second subsidiary part positioned at another side of the main part, the first subsidiary part and the second subsidiary part being spaced apart from the main part,
the main part includes a groove extending in a direction from the first subsidiary part to the second subsidiary part in an upper surface of the main part, and
a height from an upper surface of the conductive layer in a direction toward the adhesive layer to a lower surface in the groove is greater than a height from the upper surface of the conductive layer to an upper surface of the first subsidiary part.

6. The protection tape for a PCB as claimed in claim 3 , wherein the main part of the adhesive layer includes a plurality of grooves extending from an end of the main part adjacent to the first subsidiary part to an opposite end of the main part adjacent to the second subsidiary part.

7. The protection tape for a PCB as claimed in claim 1 , wherein:
an edge end surface of the insulating base plate is flush with an edge end surface of the conductive layer, and
the subsidiary part is located over the conductive layer such that an upper surface of the conductive layer around at least one edge of the conductive layer is exposed.

8. The protection tape for a PCB as claimed in claim 1 , wherein the conductive layer is positioned over the insulating base plate so as to expose an upper surface of the insulating base plate around at least one edge of the insulating base plate.

9. The protection tape for the PCB as claimed in claim 1 , wherein the main part and the subsidiary part are spaced apart from each other.

10. The protection tape for the PCB as claimed in claim 1 , wherein the subsidiary part includes a conductive material.

11. The protection tape for the PCB as claimed in claim 1 , a hardness of the subsidiary part is greater than a hardness of the main part.

12. The protection tape for the PCB as claimed in claim 1 , wherein:
each of the main part and the subsidiary part includes oligomers and monomers, and
a ratio of the monomers to the oligomers in the subsidiary part is higher than a ratio of the monomers to oligomers in the main part.

13. A display device, comprising:
a display panel including an upper surface and a lower surface and bending at an end part of the display panel: a printed circuit board (PCB) connected to the end part of the display panel, the PCB including a first surface attached to the display panel and a second surface facing the first surface: and a protection tape covering the second surface of the PCB, the protection tape including a third surface attached to the PCB and fourth surface facing the third surface; and at least one electronic device attached to the fourth surface of the protection tape wherein the protection tape comprises: an insulating base plate; a conductive layer over the insulating base plate; and an adhesive layer over the conductive layer, the adhesive layer including a main part having a first thickness and a subsidiary part having a second thickness less than the first thickness, the main part corresponding to at least a center portion of the insulating base plate and the subsidiary part being arranged at an outside of the main part.

14. The display device as claimed in claim 13 , wherein the main part and the subsidiary part of the adhesive layer are spaced apart from each other.

15. The display device as claimed in claim 13 , wherein:
the subsidiary part of the adhesive layer includes a conductive material, and
the PCB comprises a ground part electrically connected to the subsidiary part.

16. The display device as claimed in claim 13 , wherein a hardness of the subsidiary part is greater than a hardness of the main part.

17. The display device as claimed in claim 13 , wherein:
each of a main part and a subsidiary part of the adhesive layer includes oligomers and monomers, and
a ratio of the monomers to oligomers in the subsidiary part is higher than a ratio of the monomers to oligomers in the main part.

18. The display device as claimed in claim 13 , wherein the adhesive layer does not extend beyond a boundary of the PCB.

19. The display device as claimed in claim 13 , wherein the at least one electronic device includes a battery or a camera.

Assignees

• Samsung Display Co Ltd

Inventors

• Namkung Jun
• Jung Sujin
• CHOI Hyunkyu

Classifications

• H05K1/02

  Details · CPC title

• G09F9/30 Primary

  in which the desired character or characters are formed by combining individual elements (panels comprising a number of electrodes in a single cell controlling light arriving from an independent light source, e.g. electro-optical or magneto-optical cell, G02F1/00) · CPC title

• C09J2301/16

  by the structure of the carrier layer · CPC title

• C09J2301/122

  the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title