Method and an arrangement for producing electrically conductive patterns on substrates
US-10887998-B2 · Jan 5, 2021 · US
by bonding of conductive powder, i.e. metallic powder (H05K3/12 takes precedence)
by bonding of conductive powder, i.e. metallic powder (H05K3/12 takes precedence) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/102 |
| Official title | {by bonding of conductive powder, i.e. metallic powder (H05K3/12 takes precedence)} |
| Display label | by bonding of conductive powder, i.e. metallic powder (H05K3/12 takes precedence) |
| Total patents | 87 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 10 |
| 2016 | 7 |
| 2017 | 7 |
| 2018 | 11 |
| 2019 | 14 |
| 2020 | 10 |
| 2021 | 9 |
| 2022 | 5 |
| 2023 | 8 |
| 2024 | 5 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Structure and method of manufacturing a structure for guiding electromagnetic waves
US-2020411942-A1 · Dec 31, 2020 · US
Conductive three-dimensional articles
US-10821658-B2 · Nov 3, 2020 · US
Two-phase alloy, product using said two-phase alloy, and method for producing said product
US-10718038-B2 · Jul 21, 2020 · US
Ceramic circuit board and production method therefor
US-2020163210-A1 · May 21, 2020 · US
Circuit module and method for manufacturing the same
US-10660207-B2 · May 19, 2020 · US
Method for manufacturing aluminum circuit board
US-2020120809-A1 · Apr 16, 2020 · US
Touch sensor
US-10624207-B2 · Apr 14, 2020 · US
Conductive three-dimensional articles
US-2020031041-A1 · Jan 30, 2020 · US
Printing process and system
US-2020031040-A1 · Jan 30, 2020 · US
Circuit module and method for manufacturing the same
US-2020008301-A1 · Jan 2, 2020 · US
Touch sensor
US-2019387622-A1 · Dec 19, 2019 · US
Method for printed cable installation in harness systems for aircrafts
US-2019386474-A1 · Dec 19, 2019 · US
Filling materials and methods of filling through holes of a substrate
US-2019322572-A1 · Oct 24, 2019 · US
Filling materials and methods of filling through holes of a substrate
US-2019326130-A1 · Oct 24, 2019 · US
Filling materials and methods of filling through holes of a substrate
US-2019304877-A1 · Oct 3, 2019 · US
Thinned electronic product and manufacturing method thereof
US-10349522-B2 · Jul 9, 2019 · US
System and Method for Controlling Powder Bed Density for 3D Printing
US-2019193150-A1 · Jun 27, 2019 · US
Method and system for low temperature printing of conductive metal alloys
US-2019132958-A1 · May 2, 2019 · US
Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed Structure
US-2019110366-A1 · Apr 11, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/102?
- CPC H05K3/102 is the Cooperative Patent Classification code for “by bonding of conductive powder, i.e. metallic powder (H05K3/12 takes precedence).”
- How many patents are filed under CPC H05K3/102 (by bonding of conductive powder, i.e. metallic powder (H05K3/12 takes precedence))?
- Our database includes 87 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/102 growing?
- Publication counts under this code: 8 in 2023 vs 5 in 2024 (latest complete years).