Circuit module and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-10660207-B2
Application number	US-201916565912-A
Country	US
Kind code	B2
Filing date	Sep 10, 2019
Priority date	Mar 14, 2017
Publication date	May 19, 2020
Grant date	May 19, 2020

Abstract

A circuit module includes a substrate on which a first electrode and a second electrode are provided, a first electronic component, and a first resin layer. The first electrode includes a first electrode base body and a first plating film. The second electrode and the first electronic component are covered with the first resin layer. The second electrode includes a second electrode base body, a metal column, whose one end is directly connected to the second electrode base body and another end is positioned in an inner side relative to an outer surface of the first resin layer, a second plating film with a cylindrical shape covering a side surface of a connection body of the second electrode base body and the metal column, and a covering portion connected to the other end of the metal column.

First claim

The invention claimed is:

1. A circuit module comprising:
a substrate on one main surface of which a first electrode and a second electrode are provided;
a first electronic component; and
a first resin layer,
wherein the first resin layer is provided on the one main surface of the substrate,
the first electronic component is connected to the first electrode, and arranged in the first resin layer such that a surface of the first electronic component positioned on an opposite side from a surface connected to the first electrode is at least partially exposed,
the second electrode is arranged in the first resin layer such that one end of the second electrode is positioned in an outer side portion relative to an outer surface of the first resin layer,
the first electrode includes
a first electrode base body, and
a first plating film at least partially covering an outer surface of the first electrode base body,
the second electrode includes
a second electrode base body,
a metal column, whose one end is directly connected to the second electrode base body and another end is positioned in an inner side portion relative to the outer surface of the first resin layer, the metal column comprising sintered metal powder,
a second plating film with a cylindrical shape, at least partially covering a side surface of a connection body of the second electrode base body and the metal column, and having one end flush with the other end of the metal column, and
a covering portion whose one main surface is connected to the other end of the metal column and the one end of the second plating film and another main surface is positioned in the outer side portion relative to the outer surface of the first resin layer.

2. The circuit module according to claim 1 ,
wherein the metal column has a region in which an area of a cross section orthogonal to a normal direction of the one main surface of the substrate and an area of a connection portion between the metal column and the second electrode base body are different from each other.

3. The circuit module according to claim 2 ,
wherein the surface of the first electronic component positioned on the opposite side from the surface on the side of the first electrode is configured of a polished cross section, and the outer surface of the first resin layer parallel to the one main surface of the substrate and the polished cross section of the first electronic component are flush with each other.

4. The circuit module according to claim 2 , the circuit module further comprising:
a second electronic component mounted on the other main surface of the substrate, and
a second resin layer provided on the other main surface of the substrate and covering the second electronic component.

5. The circuit module according to claim 2 ,
wherein the second plating film is constituted of a metal material harder than a metal material constituting the metal column.

6. The circuit module according to claim 2 ,
wherein an interface of the first resin layer positioned between the first resin layer and the metal column is covered with a metal material having higher corrosion resistance than corrosion resistance of the metal material constituting the metal column.

7. The circuit module according to claim 2 , the circuit module further comprising:
a covering film that at least partially covers a side surface of the second plating film,
wherein the second plating film is constituted of a metal material having higher ductility than ductility of the metal material constituting the metal column, and
the covering film is constituted of a metal material having higher ductility than the ductility of the metal material constituting the second plating film.

8. The circuit module according to claim 1 ,
wherein the surface of the first electronic component positioned on the opposite side from the surface on the side of the first electrode is configured of a polished cross section, and the outer surface of the first resin layer parallel to the one main surface of the substrate and the polished cross section of the first electronic component are flush with each other.

9. The circuit module according to claim 8 , the circuit module further comprising:
a second electronic component mounted on the other main surface of the substrate, and
a second resin layer provided on the other main surface of the substrate and covering the second electronic component.

10. The circuit module according to claim 8 ,
wherein the second plating film is constituted of a metal material harder than a metal material constituting the metal column.

11. The circuit module according to claim 8 ,
wherein an interface of the first resin layer positioned between the first resin layer and the metal column is covered with a metal material having higher corrosion resistance than corrosion resistance of the metal material constituting the metal column.

12. The circuit module according to claim 8 , the circuit module further comprising:
a covering film that at least partially covers a side surface of the second plating film,
wherein the second plating film is constituted of a metal material having higher ductility than ductility of the metal material constituting the metal column, and
the covering film is constituted of a metal material having higher ductility than the ductility of the metal material constituting the second plating film.

13. The circuit module according to claim 1 , the circuit module further comprising:
a second electronic component mounted on the other main surface of the substrate, and
a second resin layer provided on the other main surface of the substrate and covering the second electronic component.

14. The circuit module according to claim 13 ,
wherein the second plating film is constituted of a metal material harder than a metal material constituting the metal column.

15. The circuit module according to claim 13 ,
wherein an interface of the first resin layer positioned between the first resin layer and the metal column is covered with a metal material having higher corrosion resistance than corrosion resistance of the metal material constituting the metal column.

16. The circuit module according to claim 13 , the circuit module further comprising:
a covering film that at least partially covers a side surface of the second plating film,
wherein the second plating film is constituted of a metal material having higher ductility than ductility of the metal material constituting the metal column, and
the covering film is constituted of a metal material having higher ductility than the ductility of the metal material constituting the second plating film.

17. The circuit module according to claim 1 ,
wherein the second plating film is constituted of a metal material harder than a metal material constituting the metal column.

18. The circuit module according to claim 1 ,
wherein an interface of the first resin layer positioned between the first resin layer and the metal column is covered with a metal material having higher corrosion resistance than corrosion resistance of the metal material constituting the metal column.

19. The circuit module according to claim 1 , the circuit module further comprising:
a covering film that at least partially covers a side surface of the second plating film,
wherein the second plating film is constituted of a metal material having higher ductility than ductility of the metal material constituting the metal column, and
the covering film is constituted of a metal materia

Assignees

• Murata Manufacturing Co

Inventors

• Kusuyama Takafumi

Classifications

• H05K2201/09854

  Hole or via having special cross-section, e.g. elliptical · CPC title

• H05K3/38

  Improvement of the adhesion between the insulating substrate and the metal · CPC title

• H05K2203/0425

  Solder powder or solder coated metal powder · CPC title

• H05K2201/09481

  Via in pad; Pad over filled via · CPC title

• H05K2203/308

  Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs · CPC title