Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof
US-2024321757-A1 · Sep 26, 2024 · US
Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2201/045 |
| Official title | Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important |
| Display label | Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important |
| Total patents | 68 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 7 |
| 2016 | 3 |
| 2017 | 8 |
| 2018 | 10 |
| 2019 | 2 |
| 2020 | 5 |
| 2021 | 9 |
| 2022 | 3 |
| 2023 | 5 |
| 2024 | 8 |
| 2025 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof
US-12040281-B2 · Jul 16, 2024 · US
Semiconductor package assembly
US-2024196537-A1 · Jun 13, 2024 · US
Circuit and connector element alignment, circuit board assemblies
US-2024107674-A1 · Mar 28, 2024 · US
Integrated Antenna-In-Package Structure
US-2024096770-A1 · Mar 21, 2024 · US
Circuit Board Assembly and Radio Unit Comprising the Same
US-2024080981-A1 · Mar 7, 2024 · US
Power module and power device
US-11901108-B2 · Feb 13, 2024 · US
Compact hybrid metal core and inductor pcb rectifier for ev wireless charging
US-2024006919-A1 · Jan 4, 2024 · US
Methods and systems for implementing a modular platform implementing active devices
US-2023422399-A1 · Dec 28, 2023 · US
Electronic component and electronic device
US-2023300985-A1 · Sep 21, 2023 · US
Package structure with interconnection between chips and packaging method thereof
US-11670520-B2 · Jun 6, 2023 · US
Package structure with interconnection between chips and packaging method thereof
US-2023102457-A1 · Mar 30, 2023 · US
Connector assembly
US-11569595-B2 · Jan 31, 2023 · US
Display device
US-11516919-B2 · Nov 29, 2022 · US
Electronic device
US-11330715-B2 · May 10, 2022 · US
Connector assembly
US-2022045445-A1 · Feb 10, 2022 · US
Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof
US-2021375770-A1 · Dec 2, 2021 · US
Display device and manufacturing method thereof
US-11160176-B2 · Oct 26, 2021 · US
Display device
US-2021267062-A1 · Aug 26, 2021 · US
Electronic device
US-2021267059-A1 · Aug 26, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2201/045?
- CPC H05K2201/045 is the Cooperative Patent Classification code for “Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important.”
- How many patents are filed under CPC H05K2201/045 (Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important)?
- Our database includes 68 publications tagged with this CPC code.
- Is patent activity under CPC H05K2201/045 growing?
- Publication counts under this code: 8 in 2024 vs 8 in 2025 (latest complete years).