Apparatus for Treating Water using a Plasma Source that is Protected from Water

US2024199451A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2024199451-A1
Application numberUS-202218287290-A
CountryUS
Kind codeA1
Filing dateApr 28, 2022
Priority dateApr 28, 2021
Publication dateJun 20, 2024
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Apparatus for treating water is provided where the apparatus includes a reaction chamber having an air-water interface and a plasma applicator disposed in air in proximity to the air-water interface. The plasma applicator includes a solid dielectric plate sandwiched between a first electrode and a second electrode, where the first electrode is closer to the water than the second electrode. The plasma applicator further includes a first insulating layer disposed on the first electrode. The apparatus is configured to generate a plasma between the first insulating layer and the air-water interface during operation.

First claim

Opening claim text (preview).

1 . Apparatus for treating water, the apparatus comprising: a reaction chamber having an air-water interface; a plasma applicator disposed in air in proximity to the air-water interface, wherein the plasma applicator includes a solid dielectric plate sandwiched between a first electrode and a second electrode, wherein the first electrode is closer to the water than the second electrode, and wherein the plasma applicator further includes a first insulating layer disposed on the first electrode; wherein the apparatus is configured to generate a plasma between the first insulating layer and the air-water interface during operation. 2 . The apparatus of claim 1 , wherein the apparatus is configured to provide nitrogen in water as nitrates and/or nitrites. 3 . The apparatus of claim 1 , wherein the apparatus is configured to acidify water. 4 . The apparatus of claim 1 , wherein the plasma has an electron energy range from 1 eV to 10 eV and wherein the plasma has a gas temperature of 1000° C. or less. 5 . The apparatus of claim 1 , wherein the first electrode is configured in a pattern selected from the group consisting of: square meshes, rectangular meshes, triangular meshes, hexagonal meshes and 1D arrays of elements. 6 . The apparatus of claim 1 , wherein the reaction chamber is configured as a water reservoir. 7 . The apparatus of claim 1 , wherein the reaction chamber is configured as a flow chamber through which water from a reservoir is pumped. 8 . The apparatus of claim 1 , further comprising a gas circulation system. 9 . The apparatus of claim 8 , wherein the gas circulation system is configured to bubble air containing activated chemical species from the plasma through the water. 10 . The apparatus of claim 8 , wherein the gas circulation system is configured to provide oxygenated air to the plasma. 11 . The apparatus of claim 1 , further comprising a heat sink affixed to the plasma applicator. 12 . The apparatus of claim 11 , further comprising a second insulating layer sandwiched between the second electrode and the heat sink.

Assignees

Inventors

Classifications

  • Cooling arrangements · CPC title

  • using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes · CPC title

  • Ammonium nitrate fertilisers · CPC title

  • Non-contaminated water, e.g. for industrial water supply · CPC title

  • by addition of specified substances, e.g. trace elements, for ameliorating potable water (medicinal water A61K) · CPC title

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What does patent US2024199451A1 cover?
Apparatus for treating water is provided where the apparatus includes a reaction chamber having an air-water interface and a plasma applicator disposed in air in proximity to the air-water interface. The plasma applicator includes a solid dielectric plate sandwiched between a first electrode and a second electrode, where the first electrode is closer to the water than the second electrode. The …
Who is the assignee on this patent?
Univ Leland Stanford Junior
What technology area does this patent fall under?
Primary CPC classification C02F1/4608. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Jun 20 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).