On-chip diplexed multi-band submillimeter-wave/terahertz sources
US-12087867-B2 · Sep 10, 2024 · US
and elements comprising distributed inductance and capacitance · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H03B19/18 |
| Official title | and elements comprising distributed inductance and capacitance |
| Display label | and elements comprising distributed inductance and capacitance |
| Total patents | 6 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 1 |
| 2018 | 1 |
| 2019 | 1 |
| 2021 | 1 |
| 2024 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-12087867-B2 · Sep 10, 2024 · US
US-2021218368-A1 · Jul 15, 2021 · US
US-10425040-B2 · Sep 24, 2019 · US
US-10075151-B2 · Sep 11, 2018 · US
US-2016149562-A1 · May 26, 2016 · US
US-9143084-B2 · Sep 22, 2015 · US