Joints between bus-bars for compensating thermal expansion

Joints between bus-bars for compensating thermal expansion · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH02G5/002
Official title{Joints between bus-bars for compensating thermal expansion}
Display labelJoints between bus-bars for compensating thermal expansion
Total patents52

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is rapidly declining.

Patents filed per year
YearPatents
20153
20164
20174
20186
201912
20209
20213
20224
20233
20243
20261

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H02G5/002?
CPC H02G5/002 is the Cooperative Patent Classification code for “Joints between bus-bars for compensating thermal expansion.”
How many patents are filed under CPC H02G5/002 (Joints between bus-bars for compensating thermal expansion)?
Our database includes 52 publications tagged with this CPC code.
Is patent activity under CPC H02G5/002 growing?
Publication counts under this code: 3 in 2023 vs 3 in 2024 (latest complete years).