with adhesive layers

with adhesive layers · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01M2300/0097
Official titlewith adhesive layers
Display labelwith adhesive layers
Total patents53

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is stable.

Patents filed per year
YearPatents
20151
20171
20185
20195
20208
20218
20222
20234
202410
20258
20261

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H01M2300/0097?
CPC H01M2300/0097 is the Cooperative Patent Classification code for “with adhesive layers.”
How many patents are filed under CPC H01M2300/0097 (with adhesive layers)?
Our database includes 53 publications tagged with this CPC code.
Is patent activity under CPC H01M2300/0097 growing?
Publication counts under this code: 10 in 2024 vs 8 in 2025 (latest complete years).