Wire tensioner
US-2016365331-A1 · Dec 15, 2016 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L24/78 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 420 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 42 |
| 2016 | 47 |
| 2017 | 34 |
| 2018 | 45 |
| 2019 | 36 |
| 2020 | 50 |
| 2021 | 30 |
| 2022 | 31 |
| 2023 | 22 |
| 2024 | 41 |
| 2025 | 39 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Discharge examination device, wire-bonding apparatus, and discharge examination method
US-2016358879-A1 · Dec 8, 2016 · US
Methods of forming wire interconnect structures
US-9502371-B2 · Nov 22, 2016 · US
Wire bond strengthening
US-2016322329-A1 · Nov 3, 2016 · US
Method of manufacturing a semiconductor package and wire bonding apparatus for performing the same
US-9484323-B2 · Nov 1, 2016 · US
Semiconductor integrated circuit device
US-9466559-B2 · Oct 11, 2016 · US
Window clamp
US-2016276305-A1 · Sep 22, 2016 · US
Electronic component package and method for forming same
US-9437574-B2 · Sep 6, 2016 · US
Bond wire feed system and method therefor
US-9397066-B2 · Jul 19, 2016 · US
Method of manufacturing semiconductor device
US-9379086-B2 · Jun 28, 2016 · US
Wire-bonding apparatus and method of manufacturing semiconductor device
US-9368471-B2 · Jun 14, 2016 · US
Wire bonding apparatus and bonding method
US-9337166-B2 · May 10, 2016 · US
Semiconductor device
US-9337134-B2 · May 10, 2016 · US
Method of manufacturing a semiconductor package and wire bonding apparatus for performing the same
US-2016049382-A1 · Feb 18, 2016 · US
Multi-chip package and method of manufacturing the same
US-9252123-B2 · Feb 2, 2016 · US
Package-on-package assembly with wire bond vias
US-9252122-B2 · Feb 2, 2016 · US
Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip
US-9236333-B2 · Jan 12, 2016 · US
Semiconductor device and a manufacturing method thereof
US-9230937-B2 · Jan 5, 2016 · US
Semiconductor device and electronic device
US-9224879-B2 · Dec 29, 2015 · US
Coated wire for bonding applications
US-2015360316-A1 · Dec 17, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L24/78?
- CPC H01L24/78 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L24/78 (Electricity)?
- Our database includes 420 publications tagged with this CPC code.
- Is patent activity under CPC H01L24/78 growing?
- Publication counts under this code: 41 in 2024 vs 39 in 2025 (latest complete years).