Electronic device and method of manufacturing the same
US-2024404904-A1 · Dec 5, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L24/24 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 2,474 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 131 |
| 2016 | 125 |
| 2017 | 148 |
| 2018 | 148 |
| 2019 | 258 |
| 2020 | 271 |
| 2021 | 242 |
| 2022 | 227 |
| 2023 | 271 |
| 2024 | 258 |
| 2025 | 324 |
| 2026 | 71 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Integrated fan-out package and manufacturing method thereof
US-2024178120-A1 · May 30, 2024 · US
Semiconductor structure, stacked structure, and manufacturing method thereof
US-2024096849-A1 · Mar 21, 2024 · US
Tightly-coupled random access memory interface shim die
US-2024088084-A1 · Mar 14, 2024 · US
Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor package
US-2024063048-A1 · Feb 22, 2024 · US
Bio-implantable hermetic integrated ultra high density device
US-9224664-B2 · Dec 29, 2015 · US
Stub minimization using duplicate sets of signal terminals
US-9224431-B2 · Dec 29, 2015 · US
Embedded packages, methods of fabricating the same, electronic systems including the same, and memory cards including the same
US-9209150-B2 · Dec 8, 2015 · US
Methods of fabricating fan-out wafer level packages and packages formed by the methods
US-9202716-B2 · Dec 1, 2015 · US
Semiconductor devices and methods of producing these
US-9202753-B2 · Dec 1, 2015 · US
Stack packages and methods of manufacturing the same
US-9196607-B2 · Nov 24, 2015 · US
Three-dimensional chip-to-wafer integration
US-9190391-B2 · Nov 17, 2015 · US
Chip package with passives
US-9190389-B2 · Nov 17, 2015 · US
Semiconductor device having embedded integrated passive devices electrically interconnected using conductive pillars
US-9184103-B2 · Nov 10, 2015 · US
Semiconductor package having embedded semiconductor elements
US-9177859-B2 · Nov 3, 2015 · US
Semiconductor stack structure and fabrication method thereof
US-9177862-B2 · Nov 3, 2015 · US
Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
US-9170246-B2 · Oct 27, 2015 · US
Circuit module with multiple submodules
US-9171823-B2 · Oct 27, 2015 · US
Semiconductor device with discrete blocks
US-9165887-B2 · Oct 20, 2015 · US
Method for connecting a plurality of unpackaged substrates
US-9165905-B2 · Oct 20, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L24/24?
- CPC H01L24/24 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L24/24 (Electricity)?
- Our database includes 2,474 publications tagged with this CPC code.
- Is patent activity under CPC H01L24/24 growing?
- Publication counts under this code: 258 in 2024 vs 324 in 2025 (latest complete years).