Multi-compartment electrical apparatus with shared cooling assembly
US-11864358-B2 · Jan 2, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/42 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,054 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 67 |
| 2016 | 92 |
| 2017 | 72 |
| 2018 | 86 |
| 2019 | 101 |
| 2020 | 150 |
| 2021 | 107 |
| 2022 | 91 |
| 2023 | 90 |
| 2024 | 104 |
| 2025 | 80 |
| 2026 | 14 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for manufacturing a semiconductor device having multiple heat sinks
US-9224711-B2 · Dec 29, 2015 · US
Heat releasing semiconductor chip package and method for manufacturing the same
US-2015371924-A1 · Dec 24, 2015 · US
Electronic control device
US-9214406-B2 · Dec 15, 2015 · US
Semiconductor die package with pre-molded die
US-9214413-B2 · Dec 15, 2015 · US
Indium compositions
US-9206519-B2 · Dec 8, 2015 · US
Semiconductor device and method of forming thermal lid for balancing warpage and thermal management
US-9202769-B2 · Dec 1, 2015 · US
Heat radiation arrangement
US-9204572-B2 · Dec 1, 2015 · US
Semiconductor module
US-9202768-B2 · Dec 1, 2015 · US
Power module package and method for manufacturing the same
US-9202798-B2 · Dec 1, 2015 · US
High-power electronic devices containing metal nanoparticle-based thermal interface materials and related methods
US-9190342-B2 · Nov 17, 2015 · US
Method of Packaging Semiconductor Devices and Apparatus for Performing the Same
US-2015325457-A1 · Nov 12, 2015 · US
Heat sink and semiconductor device
US-9184106-B2 · Nov 10, 2015 · US
Semiconductor device including a material to absorb thermal energy
US-9165847-B2 · Oct 20, 2015 · US
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
US-9153520-B2 · Oct 6, 2015 · US
Semiconductor device and method of manufacturing semiconductor device
US-2015279763-A1 · Oct 1, 2015 · US
Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
US-9147667-B2 · Sep 29, 2015 · US
Power semiconductor assembly and module
US-9147630-B2 · Sep 29, 2015 · US
Heat removal in an integrated circuit assembly using a jumping-drops vapor chamber
US-9147633-B2 · Sep 29, 2015 · US
Molded power supply system having a thermally insulated component
US-9141157-B2 · Sep 22, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/42?
- CPC H01L23/42 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/42 (Electricity)?
- Our database includes 1,054 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/42 growing?
- Publication counts under this code: 104 in 2024 vs 80 in 2025 (latest complete years).