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High-power electronic devices containing metal nanoparticle-based thermal interface materials and related methods
US9190342B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9190342-B2 |
| Application number | US-201414466938-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 22, 2014 |
| Priority date | Aug 23, 2013 |
| Publication date | Nov 17, 2015 |
| Grant date | Nov 17, 2015 |
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Abstract
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High-power electronic components generate significant amounts of heat that must be removed in the course of normal device operations. Certain types of electronic components, such as some monolithic microwave integrated circuits and LEDs, can contain materials that are difficult to effectively bond to a heat gink in order to establish a thermal interface between the two. Device assemblies can include a heat-generating electronic component in thermal communication with a metallic heat sink via a metallic thermal interface layer. The metallic thermal interface layer is disposed between the heat-generating electronic component and the metallic heat sink. The metallic thermal interface layer is formed from a composition including a plurality of metal nanoparticles that are at least partially fused together with one another. Methods for forming a thermal interface layer include heating metal nanoparticles above their fusion temperature and subsequently cooling the liquefied metal nanoparticles to promote bonding of the electronic component.
First claim
Opening claim text (preview).
What is claimed is the following: 1. A device assembly comprising: a heat-generating electronic component in thermal communication with a metallic heat sink via a metallic thermal interface layer, the metallic thermal interface layer being disposed between the heat-generating electronic component and the metallic heat sink and the metallic thermal interface layer being formed from a composition comprising a plurality of metal nanoparticles that are at least partially fused togethe…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10W40/258Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9190342B2 cover?
- High-power electronic components generate significant amounts of heat that must be removed in the course of normal device operations. Certain types of electronic components, such as some monolithic microwave integrated circuits and LEDs, can contain materials that are difficult to effectively bond to a heat gink in order to establish a thermal interface between the two. Device assemblies can in…
- Who is the assignee on this patent?
- Lockheed Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W40/258. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).