Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/36 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,664 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 145 |
| 2016 | 160 |
| 2017 | 145 |
| 2018 | 158 |
| 2019 | 220 |
| 2020 | 214 |
| 2021 | 140 |
| 2022 | 115 |
| 2023 | 93 |
| 2024 | 119 |
| 2025 | 135 |
| 2026 | 20 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Advanced Structure for Info Wafer Warpage Reduction
US-2015380334-A1 · Dec 31, 2015 · US
Semiconductor device
US-9224663-B2 · Dec 29, 2015 · US
Stub minimization using duplicate sets of signal terminals
US-9224431-B2 · Dec 29, 2015 · US
Set-top box having dissipating thermal loads
US-9220185-B2 · Dec 22, 2015 · US
Forming in-situ micro-feature structures with coreless packages
US-9214439-B2 · Dec 15, 2015 · US
Image Capture Apparatus
US-2015358564-A1 · Dec 10, 2015 · US
Molding material and method for packaging semiconductor chips
US-9209152-B2 · Dec 8, 2015 · US
Electronic devices assembled with thermally insulating layers
US-9209105-B2 · Dec 8, 2015 · US
Semiconductor device
US-9202765-B2 · Dec 1, 2015 · US
Stall containment of rack in a data center
US-9198310-B2 · Nov 24, 2015 · US
Semiconductor package
US-9184107-B2 · Nov 10, 2015 · US
Semiconductor package and method of fabricating the same
US-9177942-B2 · Nov 3, 2015 · US
Semiconductor unit with cooler
US-9171771-B2 · Oct 27, 2015 · US
Semiconductor device and method of fabricating the same
US-9171825-B2 · Oct 27, 2015 · US
Mounting structure for printed circuit board, and semiconductor device using such structure
US-9165852-B2 · Oct 20, 2015 · US
Window ball grid array (BGA) semiconductor packages
US-9159691-B2 · Oct 13, 2015 · US
Semiconductor device for preventing a progression of a crack in a solder layer and method of manufacturing the same
US-9153519-B2 · Oct 6, 2015 · US
Bumpless build-up layer package including an integrated heat spreader
US-9153552-B2 · Oct 6, 2015 · US
Power semiconductor assembly and module
US-9147630-B2 · Sep 29, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/36?
- CPC H01L23/36 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/36 (Electricity)?
- Our database includes 1,664 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/36 growing?
- Publication counts under this code: 119 in 2024 vs 135 in 2025 (latest complete years).