Laminate package of chip on carrier and in cavity
US-2017316994-A1 · Nov 2, 2017 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/06 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 268 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 18 |
| 2016 | 26 |
| 2017 | 26 |
| 2018 | 28 |
| 2019 | 33 |
| 2020 | 19 |
| 2021 | 25 |
| 2022 | 18 |
| 2023 | 22 |
| 2024 | 28 |
| 2025 | 20 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Packaged semiconductor devices with wireless charging means
US-2017317023-A1 · Nov 2, 2017 · US
Semiconductor package with conductive clip
US-9799623-B2 · Oct 24, 2017 · US
Lens cap for a transistor outline package
US-2017294390-A1 · Oct 12, 2017 · US
Surface Mount Device Package Having Improved Reliability
US-2017278764-A1 · Sep 28, 2017 · US
ZR-based amorphous alloy
US-9745652-B2 · Aug 29, 2017 · US
Electronic power device with improved cooling
US-9711432-B2 · Jul 18, 2017 · US
Package
US-2017200662-A1 · Jul 13, 2017 · US
Molded composite enclosure for integrated circuit assembly
US-2017170085-A1 · Jun 15, 2017 · US
Photo-sensitive silicon package embedding self-powered electronic system
US-9640519-B2 · May 2, 2017 · US
Stacked silicon package assembly having an enhanced lid
US-2017092619-A1 · Mar 30, 2017 · US
Molded composite enclosure for integrated circuit assembly
US-9607914-B2 · Mar 28, 2017 · US
Heat spreader with optimized coefficient of thermal expansion and/or heat transfer
US-2017055365-A1 · Feb 23, 2017 · US
Semiconductor package with structures for cooling fluid retention
US-9564386-B2 · Feb 7, 2017 · US
Devices and methods related to packaging of radio-frequency devices on ceramic substrates
US-9564937-B2 · Feb 7, 2017 · US
Semiconductor Device and Method of Forming EMI Shielding Layer with Conductive Material Around Semiconductor Die
US-2017018507-A1 · Jan 19, 2017 · US
Semiconductor Power Package and Method of Manufacturing the Same
US-2016358838-A1 · Dec 8, 2016 · US
Semiconductor device
US-2016343755-A1 · Nov 24, 2016 · US
Customized module lid
US-9496194-B2 · Nov 15, 2016 · US
Transient electronic devices comprising inorganic or hybrid inorganic and organic substrates and encapsulates
US-9496229-B2 · Nov 15, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/06?
- CPC H01L23/06 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/06 (Electricity)?
- Our database includes 268 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/06 growing?
- Publication counts under this code: 28 in 2024 vs 20 in 2025 (latest complete years).