Semiconductor packages with an intermetallic layer
US-2025201753-A1 · Jun 19, 2025 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/81825 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 49 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 4 |
| 2017 | 8 |
| 2018 | 5 |
| 2019 | 10 |
| 2020 | 4 |
| 2021 | 2 |
| 2022 | 2 |
| 2023 | 4 |
| 2024 | 2 |
| 2025 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor packages with an intermetallic layer
US-2025183217-A1 · Jun 5, 2025 · US
Hybrid bonding structures, semiconductor devices having the same, and methods of manufacturing the semiconductor devices
US-12288765-B2 · Apr 29, 2025 · US
Semiconductor packages with an intermetallic layer
US-12255167-B2 · Mar 18, 2025 · US
Advanced Device Assembly Structures And Methods
US-2025033138-A1 · Jan 30, 2025 · US
Semiconductor package and manufacturing method thereof
US-12113044-B2 · Oct 8, 2024 · US
Advanced device assembly structures and methods
US-11999001-B2 · Jun 4, 2024 · US
Connector structure and method of forming same
US-11824026-B2 · Nov 21, 2023 · US
Diffusion soldering preform with varying surface profile
US-11764185-B2 · Sep 19, 2023 · US
Semiconductor package and manufacturing method thereof
US-2023268314-A1 · Aug 24, 2023 · US
Diffusion soldering preform with varying surface profile
US-2023065738-A1 · Mar 2, 2023 · US
Advanced Device Assembly Structures And Methods
US-2022097166-A1 · Mar 31, 2022 · US
Hybrid bonding structures, semiconductor devices having the same, and methods of manufacturing the semiconductor devices
US-2022093549-A1 · Mar 24, 2022 · US
Semiconductor packages with an intermetallic layer
US-11049833-B2 · Jun 29, 2021 · US
Connector Structure and Method of Forming Same
US-2021118833-A1 · Apr 22, 2021 · US
Connector structure and method of forming same
US-10861811-B2 · Dec 8, 2020 · US
Die encapsulation in oxide bonded wafer stack
US-10784234-B2 · Sep 22, 2020 · US
High density multi-component packages
US-10707145-B2 · Jul 7, 2020 · US
Multiple plated via arrays of different wire heights on same substrate
US-10629567-B2 · Apr 21, 2020 · US
Wafer stacking for integrated circuit manufacturing
US-2019326190-A1 · Oct 24, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/81825?
- CPC H01L2224/81825 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/81825 (Electricity)?
- Our database includes 49 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/81825 growing?
- Publication counts under this code: 2 in 2024 vs 5 in 2025 (latest complete years).