Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices
US-12142594-B2 · Nov 12, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/81801 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 806 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 140 |
| 2016 | 137 |
| 2017 | 100 |
| 2018 | 76 |
| 2019 | 70 |
| 2020 | 64 |
| 2021 | 54 |
| 2022 | 38 |
| 2023 | 32 |
| 2024 | 48 |
| 2025 | 43 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
US-9219045-B2 · Dec 22, 2015 · US
Devices employing semiconductor die having hydrophobic coatings, and related cooling methods
US-9220183-B1 · Dec 22, 2015 · US
Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
US-9209166-B2 · Dec 8, 2015 · US
Method of forming a thin substrate chip scale package device and structure
US-2015332991-A1 · Nov 19, 2015 · US
Metal coating for indium bump bonding
US-9190377-B2 · Nov 17, 2015 · US
Light emitting device and method for manufacturing same
US-9184357-B2 · Nov 10, 2015 · US
Method for assembling a chip in a flexible substrate
US-9179586-B2 · Nov 3, 2015 · US
Chip packaging method and chip package using hydrophobic surface
US-2015311177-A1 · Oct 29, 2015 · US
Wiring board and semiconductor device
US-9155195-B2 · Oct 6, 2015 · US
Integrated circuit chip assembled on an interposer
US-2015270192-A1 · Sep 24, 2015 · US
Semiconductor devices having stacked solder bumps with intervening metal layers to provide electrical interconnections
US-9142498-B2 · Sep 22, 2015 · US
Semiconductor chip assembly and method for making same
US-9137903-B2 · Sep 15, 2015 · US
Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking
US-9136259-B2 · Sep 15, 2015 · US
Low-stress dual underfill packaging
US-2015255312-A1 · Sep 10, 2015 · US
Semiconductor package
US-9129972-B2 · Sep 8, 2015 · US
Method of forming package assembly
US-2015249066-A1 · Sep 3, 2015 · US
Integrated passive flip chip package
US-9123626-B1 · Sep 1, 2015 · US
Method of forming an integrated circuit package
US-9123824-B2 · Sep 1, 2015 · US
Integrated passive flip chip package
US-2015243639-A1 · Aug 27, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/81801?
- CPC H01L2224/81801 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/81801 (Electricity)?
- Our database includes 806 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/81801 growing?
- Publication counts under this code: 48 in 2024 vs 43 in 2025 (latest complete years).