Silver-plated product
US-2015037608-A1 · Feb 5, 2015 · US
Silver-plated product and method for producing same
US9534307B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9534307-B2 |
| Application number | US-201314430653-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 17, 2013 |
| Priority date | Sep 27, 2012 |
| Publication date | Jan 3, 2017 |
| Grant date | Jan 3, 2017 |
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- Title
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- Abstract
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Abstract
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In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material or on the surface of an underlying layer formed on the base material, the surface layer of silver is formed by electroplating in a silver plating bath which contains 1 to 15 mg/L of selenium and wherein a mass ratio of silver to free cyanogen is in the range of from 0.9 to 1.8, and thereafter, an aging treatment is carried out to produce a silver-plated product wherein an area fraction in {200} orientation of the surface layer is 15% or more.
First claim
Opening claim text (preview).
The invention claimed is: 1. A silver-plated product comprising: a base material; and a surface layer consisting of silver which is formed on a surface of the base material or on a surface of an underlying layer formed on the base material, wherein an area fraction in {200} orientation of the surface layer is 15% or more. 2. A silver-plated product as set forth in claim 1 , wherein said surface layer is formed on the surface of the base material of copper or a copper alloy, or on the surface of the underlying layer of copper or a copper alloy formed on the base material. 3. A contact or terminal part which is made of a silver-plated product as set forth in claim 1 . 4. A silver-plated product as set forth in claim 1 , wherein an entire surface of said surface layer is a surface of silver.
Assignees
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Classifications
of noble metals or alloys based thereon · CPC title
Ag-base component · CPC title
by bonding of a contact marking face to a contact body portion · CPC title
Alloys based on copper · CPC title
characterised by the material, e.g. plating, or coating materials · CPC title
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- What does patent US9534307B2 cover?
- In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material or on the surface of an underlying layer formed on the base material, the surface layer of silver is formed by electroplating in a silver plating bath which contains 1 to 15 mg/L of selenium and wherein a mass ratio of silver to free cyanogen is in the range of from 0.9 to 1.8, and thereafte…
- Who is the assignee on this patent?
- Dowa Metaltech Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C25D3/46. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jan 03 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).