Method for producing an electric contact connection of a multilayer component

Patent metadata

Field	Value
Publication number	US-10090454-B2
Application number	US-201314380670-A
Country	US
Kind code	B2
Filing date	Feb 19, 2013
Priority date	Feb 24, 2012
Publication date	Oct 2, 2018
Grant date	Oct 2, 2018

Abstract

A method for producing an electric contact-connection of a multilayer component is disclosed. In an embodiment, the method includes providing a main body of the multilayer component having internal electrode layers, applying an electrically conductive material and applying a photosensitive material on the electrically conductive material. The method further includes structuring the electrically conductive material via the photosensitive material such that the internal electrode layers alternatingly are covered and uncovered by the electrically conductive material and applying an insulating material after structuring the electrically conductive material such that the internal electrode layers are alternatingly covered by the electrically conductive material and by the insulating material.

First claim

The invention claimed is:

1. A method for producing an electric contact-connection of a multilayer component, the method comprising:
providing a main body of the multilayer component having internal electrode layers;
applying an electrically conductive material;
applying a photosensitive material on the electrically conductive material;
structuring the electrically conductive material via the photosensitive material such that the internal electrode layers alternatingly are covered and uncovered by the electrically conductive material; and
applying an insulating material after structuring the electrically conductive material such that the internal electrode layers are alternatingly covered by the electrically conductive material and by the insulating material.

2. The method according to claim 1 , further comprising completely removing the photosensitive material after structuring the electrically conductive material.

3. The method according to claim 1 , wherein structuring the electrically conductive material comprises providing the photosensitive material as an etching stop.

4. The method according to claim 1 , further comprising structuring the photosensitive material, wherein structuring the electrically conductive material and structuring the photosensitive material include using three different solvents.

5. The method according to claim 4 , wherein one of the three solvents is water.

6. The method according to claim 1 , further comprising measuring the main body to determine a position of the internal electrode layers before applying the photosensitive material.

7. The method according to claim 6 , further comprising structuring of the photosensitive material is effected by an exposure mask, wherein the exposure mask is selected in accordance with a result of the measuring of the main body.

8. The method according to claim 1 , wherein the insulating material and the electrically conductive material are arranged in strip-shaped fashion alternatingly above the internal electrode layers.

Assignees

• Epcos Ag

Inventors

• Somitsch Dieter
• Rinner Franz
• Galler Martin
• Ramler Johann
• Gabl Reinhard
• Brunner Sebastian

Classifications

• H10W72/013

  of die-attach connectors · CPC title

• H01G4/252

  the terminals being coated on the capacitive element (H01G4/232 takes precedence) · CPC title

• Y10T29/435

  Solid dielectric type · CPC title

• H01G4/306

  made by thin film techniques · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title